TY - GEN ET - 1 PB - IEEE PY - 2014 SN - 9784885522871 T2 - 2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan AU - Neufeld E AU - Kuster N LA - en N1 - FEMU ID: 26334; EMF-Portal URL: https://www.emf-portal.org/en/article/26334 SP - 230-233 TI - Platform for the modeling of in vivo effects relevant to implant EM exposure safety ER -