Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2020,
Miwa K, Takenaka T, Hirata A
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-4, ISBN 978-1-7281-5580-7
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2020,
Onishi T, Niskala K, Christ A, Roman J
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-4, ISBN 978-1-7281-5580-7
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2020,
Gravina A, Moglie F, Bastianelli L, Mariani Primiani V
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-6, ISBN 978-1-7281-5580-7
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2020,
Cruciani S, Campi T, Maradei F, Feliziani M
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-4, ISBN 978-1-7281-5580-7
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2020,
Kamimura Y, Daimon K, Matsumoto N, Kimura S, Sato K
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-4, ISBN 978-1-7281-5580-7
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2020,
Di Francesco A, De Santis V
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-5, ISBN 978-1-7281-5580-7
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2020,
Lämmle T, Parspour N, Mönch M
2020 5th International Conference on Smart and Sustainable Technologies (SpliTech), Split, Croatia. IEEE: 1-6, ISBN 978-1-7281-7363-4
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2020,
Dinarević EC, Poljak D, Blažević Z
2020 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Hvar, Croatia. IEEE: 1-4, ISBN 978-1-7281-7538-6
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2020,
Xia M, Zheng J, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 257-260, ISBN 978-1-7281-7431-0
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2020,
Lan Q, Zheng J, Chen J, Zhang M
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 270-275, ISBN 978-1-7281-7431-0