Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2003,
Hirata A, Morita M, Shiozawa T
IEEE Trans Electromagn Compat 45 (1): 109-116
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2003,
Joseph W, Martens L
IEEE Trans Electromagn Compat 45 (2): 339-349
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IEEE Trans Electromagn Compat 45 (2): 330-338
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2003,
Matsumoto Y, Takeuchi M, Fujii K, Sugiura A, Yamanaka Y
IEEE Trans Electromagn Compat 45 (3): 561-566
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2002,
Hirata A, Watanabe H, Shiozawa T
IEEE Trans Electromagn Compat 44 (4): 592-594
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2002,
Kanda M, Balzano Q, Russo P, Faraone A, Bit-Babik G
IEEE Trans Electromagn Compat 44 (1): 4-10
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IEEE Trans Electromagn Compat 44 (1): 148-151
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2002,
Altman Z, Begasse B, Dale C, Karwowski A, Wiart J, Wong MF
IEEE Trans Electromagn Compat 44 (4): 588-592
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2000,
Hirata A, Matsuyama SI, Shiozawa T
IEEE Trans Electromagn Compat 42 (4): 386-393
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2000,
Wiart J, Dale C, Bosisio AV, Le Cornec A
IEEE Trans Electromagn Compat 42 (4): 376-385
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1999,
Hansen VW, Bitz AK, Streckert JR
IEEE Trans Electromagn Compat 41 (4): 487-493
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IEEE Trans Electromagn Compat 39 (1): 55-61
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1997,
Bernardi P, Cavagnaro M, Pisa S
IEEE Trans Electromagn Compat 38 (3): 357-366
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1995,
Tofani S, d'Amore G, Fiandino G, Benedetto A, Gandhi OP, Chen JY
IEEE Trans Electromagn Compat 37 (1): 96-99
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IEEE Trans Electromagn Compat 37 (4): 547-558
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IEEE Trans Electromagn Compat 35 (1): 36-45
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1992,
van Hese J, Martens L, De Zutter D, De Wagter C, Malmgren LOG, Persson BRR, Salford LG
IEEE Trans Electromagn Compat 34 (3): 292-298
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1991,
Ma MT, Larsen EB, Crawford ML
IEEE Trans Electromagn Compat 33 (4): 358-362
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1991,
Chen JY, Gandhi OP, Conover DL
IEEE Trans Electromagn Compat 33 (3): 252-261
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IEEE Trans Electromagn Compat 32 (1): 67-69
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1987,
Reilly JP, Larkin WD
IEEE Trans Electromagn Compat EMC-29 (3): 221-232
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2022,
Narusue Y, Morikawa H
IEEE Trans Magn 58 (2): 1-5
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2000,
Caputa K, Stuchly MA, Skopec M, Bassen HI, Ruggera P, Kanda M
IEEE Trans Microw Theory Tech 48 (11): 2148-2154
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2006,
Sorri MJ, Piiparinen PJ, Huttunen KH, Haho MJ
IEEE Trans Neural Syst Rehabil Eng 14 (1): 101-108
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2019,
Bieth F, Delmote P, Schneider M
IEEE Trans Plasma Sci 47 (6): 2987-2994