Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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J Egypt Soc Parasitol 38 (3): 945-956
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Deutsche Kommission Elektrotechnik Elektronik Informationstechnik in DIN und VDE (DKE),
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2006,
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2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: 82-87, ISBN 978-1-7281-0595-6
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2021,
De Miguel-Bilbao S, Hernandez JA, Suarez OJ, Marina P, Febles VM, Rabassa LE, Suarez S, Karpowicz J, Zradzinski P, Gryz K, Aguirre E, Ramos V
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 13-18, ISBN 978-1-6654-4889-5
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2021,
Cruciani S, Campi T, Maradei F, Feliziani M
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 381-385, ISBN 978-1-6654-4889-5
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2021,
Sârbu A, Miclăuș S, Șorecău E, Bechet P
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 243-248, ISBN 978-1-6654-4889-5
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2021,
Yang X, Zheng J, Chen J
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 703-706, ISBN 978-1-6654-4889-5
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2021,
Yang W, Chen Q, Xu H, Li Y, Liang W, Dawalibi FP
2021 4th International Conference on Energy, Electrical and Power Engineering (CEEPE). IEEE: 599-604, ISBN 978-1-6654-3364-8
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2019,
Cruciani S, Campi T, Maradei F, Feliziani M
2019 IEEE PELS Workshop on Emerging Technologies: Wireless Power Transfer (WoW), London, United Kingdom. IEEE: 173-176, ISBN 978-1-7281-0881-0
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2017,
Dürrenberger G, Leuchtmann P, Röösli M, Siegrist M, Sütterlin B
Bundesamt für Energie (BFE),
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2016,
Dürrenberger G, Leuchtmann P, Röösli M, Siegrist M, Sütterlin B
Bundesamt für Energie (BFE),
Statusbericht 2016: 1-113
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2015,
Cruciani S, Campi T, Feliziani M, Maradei F
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden, Germany. IEEE: 720-725, ISBN 978-1-4799-6615-8
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2015,
Armstrong R, Dawson L, Rowell AJ, Marshman CA, Ruddle AR
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden, Germany. IEEE: 662-667, ISBN 978-1-4799-6615-8
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Health Estate 60 (1): 37-8, 40-2
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2003,
Malaric K, Bartolic J
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2022,
Beard BB, Iacono MI, Guag JW, Liu Y
IEEE Electromagn Compat Mag 11 (3): 49-54
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2022,
Sassi O, Kadi M, Niederholz M
IEEE Trans Electromagn Compat 64 (1): 139-149
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2021 17th Conference on Electrical Machines, Drives and Power Systems (ELMA). IEEE: 1-4, ISBN 978-1-6654-1186-8
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2020,
Bejenaru O, Lazarescu C, Ursachianu MV, Salceanu A
2020 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: 322-326, ISBN 978-1-7281-8127-1
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2020,
Azaro R, Gandolfo A
IEEE Trans Electromagn Compat 62 (4): 1611-1618
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2020,
Wu J, Qi Y, Gong G, Fan J, Miao M, Yu W, Ma J, Drewniak JL
IEEE Trans Electromagn Compat 62 (6): 2604-2612
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2019,
Sekiba Y, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 83-86, ISBN 978-1-7281-1639-6
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2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 162-165, ISBN 978-1-7281-1639-6
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2019,
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 43-46, ISBN 978-1-7281-1639-6
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2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 744-747, ISBN 978-1-7281-1639-6
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2019,
Kageyama I, Masuda H, Morimatsu Y, Ishitake T, Sakakibara K, Hikage T, Hirata A
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 766-769, ISBN 978-1-7281-1639-6
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2019,
He Y, Leung PSW, Chow Y, Diao Y
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 750-753, ISBN 978-1-7281-1639-6
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 691-694, ISBN 978-1-7281-1639-6
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2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 48-51, ISBN 978-1-7281-1639-6
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2019,
Laakso I, Lehtinen T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 334-337, ISBN 978-1-7281-1639-6
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2019 11th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest, Romania. IEEE: 1-5, ISBN 978-1-7281-0102-6
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2018,
Ardeleanu ME, Nicoleanu P, Stanescu DG, Pisleag D
2018 International Conference on Applied and Theoretical Electricity (ICATE), Craiova. IEEE: 1-6, ISBN 978-1-5386-3807-1
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2018,
Feliziani M, Campi T, Cruciani S, De Santis V
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam. IEEE: 155-160, ISBN 978-1-4673-9699-8
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2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 959-962, ISBN 978-1-5090-3955-5
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2018,
Douglas MG, Pfeifer S, Kuehn S, Neufeld E, Pokovic K, Carrasco E, Samaras T, Christ A, Capstick M, Kuster N
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 92-94, ISBN 978-1-5090-3955-5
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2018,
Fukui S, Maeda N, Xiao F, Kami Y
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 331-335, ISBN 978-1-5090-3955-5
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2018,
Munhoz-Rojas PE, Segura-Salas CS, Costa AA, Martins R, Hoffmann-Neto J
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 1267-1273, ISBN 978-1-5090-3955-5
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2018,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong YC
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 872-874, ISBN 978-1-5090-3955-5
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2018,
He Y, Sun W, Leung PSW, Siu TYM, Ng KT
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 936-939, ISBN 978-1-5090-3955-5
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2018,
Koh WJ, Moochhala SM
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 518-522, ISBN 978-1-5090-3955-5
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2016,
Luca C, Andriţoi D, Corciovă C, Ciorap R
2016 International Conference and Exposition on Electrical and Power Engineering (EPE). IEEE: ISBN 978-1-5090-6130-3
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2015,
Pavlik M, Lisoň L, Kurimský P
8th International Scientific Symposium on Electrical Power Engineering (ELEKTROENERGETIKA 2015). Kolcun M, Kurimský J, Kolcunová I (Hrsg.): Curran Associates, Inc., Red Hook, NY: 560-563, ISBN 978-1-5108-1142-3
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2015,
Bohmelt S, Scharf F, Dudzinski M, Rozgic M, Fichte LO, Stiemer M
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden, Germany. IEEE: 535-540, ISBN 978-1-4799-6615-8
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2011,
Calcagnini G, Mattei E, Censi F, Triventi M, Lo Sterzo R, Marchetta E, Bartolini P
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2010,
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IEEE Transactions on Power Delivery 25 (4): 3085-3094
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1997,
Watson DB, Sedcole NP, Chan E, Smart KG, Patel SM
IET 10th International Conference on (Conf. Publ. No. 445) Electromagnetic Compatibility, 1997. IET: 54-58
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1995,
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2021,
Svistunou A, Mordachev V, Sinkevich E, Ye M, Dubovik A
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 214-219, ISBN 978-1-6654-4889-5