Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2020,
Bejenaru O, Lazarescu C, Ursachianu MV, Salceanu A
2020 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: 322-326, ISBN 978-1-7281-8127-1
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2020,
Azaro R, Gandolfo A
IEEE Trans Electromagn Compat 62 (4): 1611-1618
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2020,
Wu J, Qi Y, Gong G, Fan J, Miao M, Yu W, Ma J, Drewniak JL
IEEE Trans Electromagn Compat 62 (6): 2604-2612
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2019,
Sekiba Y, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 83-86, ISBN 978-1-7281-1639-6
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2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 162-165, ISBN 978-1-7281-1639-6
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2019,
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 43-46, ISBN 978-1-7281-1639-6
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2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 744-747, ISBN 978-1-7281-1639-6
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2019,
Kageyama I, Masuda H, Morimatsu Y, Ishitake T, Sakakibara K, Hikage T, Hirata A
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 766-769, ISBN 978-1-7281-1639-6
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2019,
He Y, Leung PSW, Chow Y, Diao Y
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 750-753, ISBN 978-1-7281-1639-6
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 691-694, ISBN 978-1-7281-1639-6