Die folgenden Begriffe wurden einbezogen:
transkraniell, transcranial, 経頭蓋
-
2019,
Khan A, Haueisen J, Wolters CH, Antonakakis M, Vogenauer N, Wollbrink A, Suntrup-Krueger S, Schneider TR, Herrmann CS, Nitsche M, Paulus W
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: 5894-5897, ISBN 978-1-5386-1312-2
-
2019,
Petersen TH, Puthusserypady S
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: 4509-4512, ISBN 978-1-5386-1312-2
-
2019,
Colella M, Laher RM, Press DZ, McIlduff CE, Rutkove SB, Pascual-Leone A, Apollonio F, Liberti M, Bonmassar G
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: 3987-3990, ISBN 978-1-5386-1312-2
-
2019,
Colella M, Paffi A, Fontana S, Rossano F, De Santis V, Apollonio F, Liberti M
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: 2917-2920, ISBN 978-1-5386-1312-2
-
2019,
Fernandes SR, Salvador R, de Carvalho M, Miranda PC
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: 5898-5901, ISBN 978-1-5386-1312-2
-
2019,
Callejon-Leblic MA, Miranda PC
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: 5913-5917, ISBN 978-1-5386-1312-2
-
2019,
Thomas C, Ghodratitoostani I, Delbem ACB, Ali A, Datta A
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: 5196-5199, ISBN 978-1-5386-1312-2
-
2019,
Thomas C, Huang Y, Faria PC, Datta A
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: 6442-6445, ISBN 978-1-5386-1312-2
-
2019,
Lin CY, Lee KM, Chen YL, Huang SC
2019 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM), Hong Kong, China. IEEE: 1522-1527, ISBN 978-1-7281-2494-0
-
2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 162-165, ISBN 978-1-7281-1639-6