The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2013,
Higashiyama J, Tarusawa Y
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 93-98; ISBN 978-1-4673-4980-2
-
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 449-454; ISBN 978-1-4673-4980-2
-
2013,
Hirata A, Tsuchida S, Laaskso I
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 89-92; ISBN 978-1-4673-4980-2
-
2013,
Hikage T, Kawamura Y, Nojima T, Nagaoka T, Watanabe S
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 165-168; ISBN 978-1-4673-4980-2
-
2013,
Alkahtani AA, Nordin FH, Sharrif ZAM
2013 IEEE International Conference on Control System, Computing and Engineering, Penang, Malaysia. IEEE: 321-324; ISBN 978-1-4799-1508-8
-
2013,
Ruddle AR, Low L, Vassilev A
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 78-83; ISBN 978-1-4673-4980-2
-
2013,
Julstrom SD, Kozma-Spytek LK, Beard BB
IEEE Electromagn Compat Mag 2 (2): 69-81
-
2013,
Bullo M, Dughiero F, Sieni E
IEEE Electromagn Compat Mag 2 (2): 49-58
-
IEEE Electromagn Compat Mag 2 (4): 71
-
2013,
Melia GCR, Robinson MP, Flintoft ID, Marvin AC, Dawson JF
IEEE Trans Electromagn Compat 55 (6): 1043-1050
-
IEEE Trans Electromagn Compat 55 (2): 275-287
-
2013,
Christ A, Douglas MG, Roman JM, Cooper EB, Sample AP, Waters BH, Smith JR, Kuster N
IEEE Trans Electromagn Compat 55 (2): 265-274
-
2013,
Seidman SJ, Guag JW
Biomed Eng Online 12: 71
-
2014,
Carsimamovic A, Mujezinovic A, Carsimamovic S, Muharemovic A, Bajramovic Z
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 611-614; ISBN 978-1-4799-3226-9
-
2014,
Laissaoui AM, Nekhoul B, Poljak D, Kerroum K, Drissi KE
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 974-979; ISBN 978-1-4799-3226-9
-
2014,
Yngve Hamnerius, Tomas Nilsson
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 364-368; ISBN 978-1-4799-3226-9
-
2014,
Döbbelin R, Förster S, Lindemann A
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 369-374; ISBN 978-1-4799-3226-9
-
2014,
Lisewski T, Luszcz J
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 360-363; ISBN 978-1-4799-3226-9
-
2014,
Kavya M, Yashodhara B, Arunachalam V, Devendranath D, Yellaiah A, Rashmi, Sailaja RRN
2014 International Conference on Power Signals Control and Computations (EPSCICON), Thrissur, India. IEEE: 1-6
-
2014,
Ptitsyna NG, Ponzetto A, Kopytenko YA, Ismagilov VS, Korobeinikov AG
J Sci Res Rep 3 (13): 1753 - 1770
-
2014,
Theodoridis MP, Mollov SV
Biomed Tech 59 (5): 461-469
-
2014,
Marshman CA, Armstrong R, Dawson L, Rowell AJ, Ruddle AR
5th IET Hybrid and Electric Vehicles Conference (HEVC 2014), London, UK. IET: 14737980; ISBN 978-1-84919-911-7
-
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 354-359; ISBN 978-4-88552-287-1
-
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 348-353; ISBN 978-4-88552-287-1
-
2014,
Haridim M, Levin B, Revich S, Chulski S, Sauleau R, Zemach R
IEEE Electromagn Compat Mag 3 (4): 43-48
-
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 745-748; ISBN 978-4-88552-287-1
-
2014,
Diao YL, Sun WN, Chan KH, Leung SW, Siu YM
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 226-229; ISBN 978-4-88552-287-1
-
2014,
Laakso I, Hirata A, Fujiwara O
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 202-205; ISBN 978-4-88552-287-1
-
2014,
Sunohara T, Laakso I, Hirata A, Onishi T
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 449-452; ISBN 978-4-88552-287-1
-
2014,
Nagaoka T, Watanabe S, Niwa T
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 190-193; ISBN 978-4-88552-287-1
-
2014,
Sasaki K, Nagaoka T, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 537-540; ISBN 978-4-88552-287-1
-
2014,
Tateno A, Tanaka K, Nagaoka T, Watanabe S, Saito K, Takahashi M, Ito K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 186-189; ISBN 978-4-88552-287-1
-
2014,
Kim M, Kim S, Ahn S, Chun Y, Park S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 426-429; ISBN 978-4-88552-287-1
-
2014,
Wiart J, Conil E, Varsier N, Sarrebourse T, Hadjem A, Martens L, Wermeeren G, Corre Y
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 635-637; ISBN 978-4-88552-287-1
-
2014,
Shiina T, Suzuki Y, Kasai Y, Inami Y, Taki M, Wake K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 166-169; ISBN 978-4-88552-287-1
-
2014,
Chakarothai J, Suzuki Y, Taki M, Kojima M, Sasaki K, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 182-185; ISBN 978-4-88552-287-1
-
2014,
Cabot E, Zastrow E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 237-240; ISBN 978-4-88552-287-1
-
2014,
Choi DG, Kim KH, Jang JD, Chung SY, Gimm YM
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 638-641; ISBN 978-4-88552-287-1
-
2014,
Kim HS, Lee YH, Choi HD, Lee AK, Lee YS, Pack JK, Kim N, Ahn YH
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 170-173; ISBN 978-4-88552-287-1
-
2014,
Suzuki Y, Koike A, Takamura M, Taki M, Kojima M, Sasaki K, Chakarothai J, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 832-835; ISBN 978-4-88552-287-1
-
2014,
Neufeld E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 230-233; ISBN 978-4-88552-287-1
-
2014,
Laakso I, Shimamoto T, Hirata A, Feliziani M
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 430-433; ISBN 978-4-88552-287-1
-
2014,
Kang WG, Alexander Z, Jun HY, Park YH, Pack JK
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 198-201; ISBN 978-4-88552-287-1
-
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 194-197; ISBN 978-4-88552-287-1
-
2014,
Arima T, Uno T, Wake K, Fujii K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 529-532; ISBN 978-4-88552-287-1
-
2014,
Shimizu HO, Shimizu K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 162-165; ISBN 978-4-88552-287-1
-
2014,
Higashiyama J, Tarusawa Y
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 650-653; ISBN 978-4-88552-287-1
-
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 625-628; ISBN 978-4-88552-287-1
-
2014,
Miyaji Y, Shimada M, Mizuno Y, Naito K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 621-624; ISBN 978-4-88552-287-1
-
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 206-209; ISBN 978-4-88552-287-1