The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2006,
Sorri MJ, Piiparinen PJ, Huttunen KH, Haho MJ
IEEE Trans Neural Syst Rehabil Eng 14 (1): 101-108
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2023,
Souček T, Richter A, Morava J, Slavík L
2023 5th International Congress on Human-Computer Interaction, Optimization and Robotic Applications (HORA), Istanbul, Turkiye. IEEE: 1-4; ISBN 9798350337532
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2012,
Spathmann O, Hansen V, Streckert J, Zhou Y, Clemens M, Grote K, Klose M, Lerchl A
International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, 2012. IEEE: 13225800; ISBN 978-1-4673-0717-8
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2024,
Sufian MA, Hussain N
IEEE Trans Electromagn Compat [in press]
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2018,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong YC
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 872-874; ISBN 978-1-5090-3955-5
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2017,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong RYC, Lo WK
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
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2017,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong R
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, Korea (South). IEEE; ISBN 978-1-5386-3913-9
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2014,
Sunohara T, Laakso I, Hirata A, Onishi T
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: 449-452; ISBN 978-4-88552-287-1
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2021,
Šušnjara A, Dodig H, Poljak D, Cvetković M
IEEE Trans Electromagn Compat 63 (5): 1667-1679
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2014,
Suzuki Y, Koike A, Takamura M, Taki M, Kojima M, Sasaki K, Chakarothai J, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: 832-835; ISBN 978-4-88552-287-1
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2022,
Svistunou A, Mordachev V, Sinkevich E, Ye M, Dubovik A, Shakinka I
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 537-542; ISBN 978-1-6654-0789-2
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2021,
Svistunou A, Mordachev V, Sinkevich E, Ye M, Dubovik A
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 214-219; ISBN 978-1-6654-4889-5
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2017,
Takei R, Nagaoka T, Saito K, Watanabe S, Takahashi M
IEEE Trans Electromagn Compat 59 (2): 747-753
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2012 Asia-Pacific Symposium on Electromagnetic Compatibility, Singapore, 2012. IEEE: 737-740; ISBN 978-1-4577-1557-0
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2016,
Tarmizi AI, Rotaru MD, Sykulski JK
2016 IEEE 16th International Conference on Environment and Electrical Engineering (EEEIC), Florence, Italy. IEEE: 1-6; ISBN 978-1-5090-2321-9
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2007,
Tarusawa Y, Nishiki S, Nojima T
IEEE Transactions on Vehicular Technology 56 (3): 1295-1306
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2005,
Tarusawa Y, Ohshita K, Suzuki Y, Nojima T, Toyoshima T
IEEE Trans Electromagn Compat 47 (4): 938-950
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2014,
Tateno A, Tanaka K, Nagaoka T, Watanabe S, Saito K, Takahashi M, Ito K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: 186-189; ISBN 978-4-88552-287-1
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2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 145-150; ISBN 978-1-6654-0789-2
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1979,
Tell RA, Mantiply ED
1979 IEEE International Symposium on Electromagnetic Compatibility, San Diego, CA, USA. IEEE: 252-256; ISBN 978-1-5090-3165-8
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2014,
Theodoridis MP, Mollov SV
Biomed Tech 59 (5): 461-469
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2008,
Thors B, Strydom ML, Hansson B, Meyer FJC, Kärkkäinen K, Zollman P, Ilvonen S, Törnevik C
IEEE Trans Electromagn Compat 50 (4): 837 - 848
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2020,
Titov EV, Soshnikov AA, Drobyazko ON
2020 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM), Sochi, Russia. IEEE: 1-5; ISBN 978-1-7281-4591-4
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2005,
Tkalec M, Malaric K, Pevalek-Kozlina B
Bioelectromagnetics 26 (3): 185-193
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IEEE Trans Electromagn Compat 44 (1): 148-151