キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2023,
Parsa N, Sanphuang V
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 655, ISBN 9798350309775
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2023,
Boukabou I, Rupanetti D, Kaabouch N, Foust L
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 413-418, ISBN 9798350309775
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2023,
Asadi R, Aliakbarian H, Sahraei A, Yazdani R, Kim DH
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 608-613, ISBN 9798350309775
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2023,
Hwata C, Rushingabigwi G, Gatera O, Twizere C, Mukanyiligira D, Thomas BN
2023 Photonics & Electromagnetics Research Symposium (PIERS), Prague, Czech Republic. IEEE: 1389-1396, ISBN 9798350312850
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2023,
Voicu V, Dina LA, Mircea PM, Dumbrava I
[磁界および電界測定実験]
[tech./dosim.]
2023 Power Quality and Electromagnetic Compatibility at Low Frequency (PQEMC-LF), Craiova, Romania. IEEE: 61-64, ISBN 9798350341348
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2023,
Kuchina AP, Zakirova EA
2023 Systems of Signal Synchronization, Generating and Processing in Telecommunications (SYNCHROINFO), Pskov, Russian Federation. IEEE: 1-4, ISBN 9798350348323
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2023,
Souček T, Richter A, Morava J, Slavík L
2023 5th International Congress on Human-Computer Interaction, Optimization and Robotic Applications (HORA), Istanbul, Turkiye. IEEE: 1-4, ISBN 9798350337532
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2022,
Yang X, Guo R, Zheng J, Chen J
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: 606-609, ISBN 978-1-6654-0930-8
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2022,
Li Y, Liu D, Zhang J, Wu L
2022 International Conference on Mechanical and Electronics Engineering (ICMEE), Xi'an, China. IEEE: 162-166, ISBN 978-1-6654-9221-8
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2022,
Bräunlich R, Dalmus C, Dongus S, Eberhard J, Friedrich G, Fröhlich J, Röösli M, Schürmann D
Swiss Federal Office of Energy (SFOE),
Statusbericht 2022: 1-204
