キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2020,
Arduino A, Bottauscio O, Chiampi M, Giaccone L, Liorni I, Kuster N, Zilberti L, Zucca M
IEEE Trans Electromagn Compat 62 (5): 1939-1950
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2014,
Arima T, Uno T, Wake K, Fujii K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 529-532; ISBN 978-4-88552-287-1
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2015,
Armstrong R, Dawson L, Rowell AJ, Marshman CA, Ruddle AR
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden, Germany. IEEE: 662-667; ISBN 978-1-4799-6615-8
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2023,
Asadi R, Aliakbarian H, Sahraei A, Yazdani R, Kim DH
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 608-613; ISBN 9798350309775
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2020,
Asadi R, Aliakbarian H, Khayambashi G, Majdolashrafi P
IEEE Electromagn Compat Mag 9 (3): 45-54
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2019,
Atefi SR, Serano P, Poulsen C, Angelone LM, Bonmassar G
IEEE Trans Electromagn Compat 61 (3): 852-859
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2020,
Attaran A, Handler WB, Chronik BA
IEEE J Electromagn RF Microw Med Biol 4 (1): 2 - 9
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2020,
Attaran A, Handler WB, Chronik BA
IEEE Trans Electromagn Compat 62 (1): 186 - 193
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2006,
Augello A, Della Chiara G, Primiani V, Moglie F
IEEE Trans Electromagn Compat 48 (3): 502-515
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2004,
Ayata A, Mollaoglu H, Yilmaz HR, Akturk O, Özgüner F, Altuntas I
J Dermatol 31 (11): 878-883