キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2023,
Kuchina AP, Zakirova EA
2023 Systems of Signal Synchronization, Generating and Processing in Telecommunications (SYNCHROINFO), Pskov, Russian Federation. IEEE: 1-4; ISBN 9798350348323
-
IEEE Trans Electromagn Compat 65 (5): 1282-1291
-
2023,
Souček T, Richter A, Morava J, Slavík L
2023 5th International Congress on Human-Computer Interaction, Optimization and Robotic Applications (HORA), Istanbul, Turkiye. IEEE: 1-4; ISBN 9798350337532
-
2023,
Campi T, Cruciani S, Maradei F, Feliziani M
Energies 16 (9): 3822
-
2023,
Shikhantsov S, Thielens A, Vermeeren G, Demeester P, Martens L, Joseph W
IEEE Trans Electromagn Compat 65 (4): 960-971
-
IEEE Trans Electromagn Compat 65 (4): 1090-1097
-
2023,
Yao M, Zhekov SS, Xu B, Li K, Zhang S
IEEE Trans Electromagn Compat 65 (5): 1292-1299
-
2023,
Li Y, Ying Y, Xie K, Pan S
IEEE Trans Electromagn Compat 65 (3): 643-654
-
2023,
Orlacchio R, Andrieu G, Joushomme A, Patrignoni L, Hurtier A, Poulletier de Gannes F, Lagroye I, Percherancier Y, Arnaud-Cormos D, Leveque P
IEEE Trans Electromagn Compat 65 (1): 39-50
-
2022,
Li E, Li XJ, Seet BC
2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), Chengdu, China. IEEE: 101-104; ISBN 978-1-6654-2776-0