By:
Remley KA, Gordon JA, Novotny D, Curtin AE, Holloway CL, Simons MT, Horansky RD, Allman MS, Senic D, Becker M, Jargon JA, Hale PD, Williams DF, Feldman A, Cheron J, Chamberlin R, Gentile C, Senic J, Sun R, Papazian PB, Quimby J, Mujumdar M, Golmie N
Published in: IEEE Microw Mag 2017; 18 (5): 41 - 56
