By:
He Y, Leung PSW, Chow Y, Diao Y
Published in: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan IEEE, 2019: 750-753, ISBN-13 978-1-7281-1639-6, ISBN-10 1728116392
