By:
He Y, Leung PSW, Chow Y, Diao Y
Published in: No authors listed, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan IEEE, 2019: 750-753, ISBN 9781728116396
