The following terms were included:
"Institute of Electrical and Electronics Engineers", IEEE, 米国電気電子学会
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2017,
Zheng J, Yang R, Chen J
2017 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, San Diego, CA, USA. IEEE: 1011-1012; ISBN 978-1-5386-0898-2
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2005,
Zheng J, Li L, Huo X
2005 IEEE Engineering in Medicine and Biology 27th Annual Conference, Shanghai. IEEE: 1529-1532; ISBN 978-0-7803-8741-6
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2024,
Zheng M, Wang Y, Chen S, Suo Y, Yu J, Zhang X
IEEE Trans Biomed Eng [in press]
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2019,
Zheng Y, Tian X, Dong L, Ma X, Gao Y, Xiong C, Zhang K, Li C
IEEE Access 7: 152919-152927
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2021,
Zheng Z, Ntawangaheza JD, Sun L
2021 International Conference on Electronics, Circuits and Information Engineering (ECIE), Zhengzhou, China. IEEE: 1-5; ISBN 978-1-6654-4810-9
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2018 International Power Electronics Conference (IPEC-Niigata 2018 -ECCE Asia), Niigata, Japan. IEEE: 2569-2575; ISBN 978-1-5386-4190-3
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2022,
Zhong X, Jiang H, Jiles DC, Wang Z, Li J, Song B
2022 44th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Glasgow, Scotland, United Kingdom. IEEE: 3939-3942; ISBN 978-1-7281-2783-5
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2024,
Zhou C, Snyder DP, Epstein B, Robinson ZT, Jin GY, Tang PY, Polcawich RG, Roper M
IEEE Trans Electromagn Compat [in press]
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2022,
Zhou C, Synder DP, Epstein B, Robinson ZT, Jin GY, Tang PY, Polcawich RG, Roper M
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: 439-442; ISBN 978-1-6654-0930-8
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2022,
Zhou H, Zhang R, Tian Y, Peng H, Wang H, Mao J
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Urbana, IL, USA. IEEE: 1-3; ISBN 978-1-6654-9195-2