The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2022,
Bertoluzzo M, Di Barba P, Forzan M, Mognaschi ME, Sieni E
Eng Comput 39 (7): 2802-2819
-
2019,
Bieth F, Delmote P, Schneider M
IEEE Trans Plasma Sci 47 (6): 2987-2994
-
2014,
Bieth F, Schunck T, Pinguet S, Delmote P
IEEE Trans Electromagn Compat 56 (4): 964-969
-
2012,
Bini M, Feroldi P, Ferri C, Ignesti A, Olmi R, Priori S, Riminesi C, Tobia L
G Ital Med Lav Ergon 34 (3) Suppl: 595-598
-
2007,
Bit-Babik G, Morrissey JJ, Faraone A, Balzano Q
Ann Ist Super Sanita 43 (3): 218-224
-
2015,
Bohmelt S, Scharf F, Dudzinski M, Rozgic M, Fichte LO, Stiemer M
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden, Germany. IEEE: pp. 535-540; ISBN 978-1-4799-6615-8
-
2020,
Bonato M, Dossi L, Chiaramello E, Fiocchi S, Gallucci S, Tognola G, Ravazzani P, Parazzini M
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-4; ISBN 978-1-7281-5580-7
-
Herzschrittmacherther Elektrophysiol 15 (1): 3-8
-
2019,
Botsa VR, Kumar Munaka S, Dushyanth M, Bandaru S
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON), Bangalore, India. IEEE: pp. 1-4; ISBN 978-1-7281-4153-4
-
2009,
Bottauscio O, Chiampi M, Pastorelli M, Pons E, Zilberti L
2009 13th European Conference on Power Electronics and Applications, Barcelona, Spain. IEEE: pp. 1-10; ISBN 978-1-4244-4432-8
-
2023,
Boukabou I, Rupanetti D, Kaabouch N, Foust L
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: pp. 413-418; ISBN 9798350309775
-
Telemed J E Health 12 (3): 373-382
-
Health Estate 60 (1): 37-8, 40-2
-
Med Device Technol 15 (8): 33-4, 36
-
2022,
Bräunlich R, Dalmus C, Dongus S, Eberhard J, Friedrich G, Fröhlich J, Röösli M, Schürmann D
Swiss Federal Office of Energy (SFOE),
Statusbericht 2022: 1-204
-
2020,
Brizi D, Fontana N, Tucci M, Barmada S, Monorchio A
IEEE Trans Electromagn Compat 62 (4): 1312-1322
-
1975,
Bronaugh EL, Kerns DR
1975 IEEE International Symposium on Electromagnetic Compatibility, San Antonio, TX, USA. IEEE: 5BIIb1-5BIIb5; ISBN 978-1-5090-3161-0
-
2007,
Buccella C, De Santis V, Feliziani M
IEEE Trans Electromagn Compat 49 (4): 825-833
-
2022,
Budnarowska M, Mizeraczyk J, Bisewski D
Prz Elektrotechniczny 98 (2): 110-113
-
2018,
Buesink F, Vout-Ardatjew R, Leferink L
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: pp. 918-921; ISBN 978-1-4673-9699-8
-
Polit Zeitgesch 53 (B42): 35-46
-
2013,
Bullo M, Dughiero F, Sieni E
IEEE Electromagn Compat Mag 2 (2): 49-58
-
2017,
Bulut F, Efendioglu HS, Solak V, Yabuloglu M, Özer H
2017 IV International Electromagnetic Compatibility Conference (EMC Turkiye), Ankara, Turkey. IEEE, Ankara, Turkey: pp. 1-3; ISBN 978-1-5090-4821-2
-
2007,
Buzduga V, Witters DM, Casamento JP, Kainz W
IEEE Trans Biomed Eng 54 (9): 1679-1686
-
2014,
Cabot E, Zastrow E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 237-240; ISBN 978-4-88552-287-1