The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2022,
Li E, Li XJ, Seet BC
2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), Chengdu, China. IEEE: 101-104; ISBN 978-1-6654-2776-0
-
2022,
Li J, Changyuan W, Yujie Z
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: 261-263; ISBN 978-1-6654-1672-6
-
IEEE Trans Electromagn Compat 64 (4): 941-950
-
2022,
Li S, Jiang Y, Tang C, Luo Z, Liu L, Li Z, Gu C
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: 563-565; ISBN 978-1-6654-1672-6
-
2019,
Li X, Zhu F, Lu H, Qiu R, Tang Y
IEEE Trans Electromagn Compat 61 (2): 319 - 326
-
2023,
Li Y, Ying Y, Xie K, Pan S
IEEE Trans Electromagn Compat 65 (3): 643-654
-
2022,
Li Y, Liu D, Zhang J, Wu L
2022 International Conference on Mechanical and Electronics Engineering (ICMEE), Xi'an, China. IEEE: 162-166; ISBN 978-1-6654-9221-8
-
2016,
Lingdi F, Guizhi X, Hongli Y, Miaomiao G, Ning Y
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Shenzhen, China. IEEE: 1035-1037; ISBN 978-1-4673-9494-9
-
2020,
Liorni I, Lisewski T, Capstick MH, Kuehn S, Neufeld E, Kuster N
IEEE Trans Electromagn Compat 62 (4): 1323-1332
-
2016,
Lisewski T, Mikolajczyk A, Abramik S, Rucinski M
2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Wroclaw, Poland. IEEE: 497-500; ISBN 978-1-5090-1417-0
-
2014,
Lisewski T, Luszcz J
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 360-363; ISBN 978-1-4799-3226-9
-
2022,
Liu J, Wang Y, Guo R, Wang Q, Zheng J, Kurpad K, Kainz W, Chen J
IEEE Trans Electromagn Compat 64 (2): 286-294
-
2019,
Liu J, Zheng J, Zeng Q, Wang Q, Rondoni J, Olsen J, Kainz W, Chen J
IEEE Trans Electromagn Compat 61 (4): 1091-1097
-
2022,
Liu S, Onishi T, Taki M, Watanabe S
IEEE Trans Electromagn Compat 64 (4): 963-974
-
2017,
Lopez DG, Ignatenko M, Filipovic DS
IEEE Trans Electromagn Compat 59 (1): 43-47
-
2021,
Lottner T, Reiss S, Bitzer A, Bock M, Özen AC
IEEE Trans Electromagn Compat 63 (3): 662-672
-
2005,
Loughran SP, Wood AW, Barton JM, Croft RJ, Thompson B, Stough C
NeuroReport 16 (17): 1973-1976
-
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Shenzhen, China. IEEE: 1084-1086; ISBN 978-1-4673-9494-9
-
2016,
Luca C, Andriţoi D, Corciovă C, Ciorap R
2016 International Conference and Exposition on Electrical and Power Engineering (EPE), Iasi, Romania. IEEE; ISBN 978-1-5090-6130-3
-
1984,
Lucas JH, Johnson MJ
1984 National Symposium on Electromagnetic Compatibility, San Antonio, TX. IEEE: 157-160; ISBN 978-1-5090-3170-2
-
2018 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: 693-696; ISBN 978-1-5386-5063-9
-
2001,
Lyznicki JM, Altman RD, Williams MA
Biomed Instrum Technol 35 (3): 189-195
-
1991,
Ma MT, Larsen EB, Crawford ML
IEEE Trans Electromagn Compat 33 (4): 358-362
-
2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Wroclaw, Poland. IEEE: 467-473; ISBN 978-1-5090-1417-0
-
2003,
Malaric K, Bartolic J
Turk J Elec Eng & Comp Sci 11 (2): 143-154