The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2021,
De Miguel-Bilbao S, Hernandez JA, Suarez OJ, Marina P, Febles VM, Rabassa LE, Suarez S, Karpowicz J, Zradzinski P, Gryz K, Aguirre E, Ramos V
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 13-18; ISBN 978-1-6654-4889-5
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2019,
De Miguel-Bilbao S, Blas J, Karpowicz J, Ramos V
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: 1112-1115; ISBN 978-1-7281-0595-6
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2018,
De Miguel-Bilbao S, Blas J, Falcone F, Ramos V
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 510-514; ISBN 978-1-4673-9699-8
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2017,
De Miguel-Bilbao S, Blas J, Aguirre E, Iturri PL, Azpilicueta L, Falcone F, Ramos V
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
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2011,
De Santis V, Beeckman PA, Lampasi DA, Feliziani M
IEEE Trans Biomed Eng 58 (2): 390-396
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Arch Mal Coeur Vaiss 96 (Spec. III): 65-70
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2016,
Degirmenci E, Thors B, Törnevik C
IEEE Trans Electromagn Compat 58 (4): 1110-1117
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1974,
del Blanco JB, Romero-Sierra C, Tanner JA
1974 IEEE Electromagnetic Compatibility Symposium Record, San Francisco, CA, USA. IEEE: 1-7; ISBN 978-1-5090-3160-3
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1973,
del Blanco JB, Romero-Sierra C, Tanner JA
1973 IEEE International Electromagnetic Compatibility Symposium Record, New York, NY, USA. IEEE: 1-6; ISBN 978-1-5090-3159-7
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2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 959-962; ISBN 978-1-5090-3955-5
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2020,
Dergham I, Martinez Rocha JC, Imad R, Alayli Y
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-5; ISBN 978-1-7281-5580-7
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2020,
Di Francesco A, De Santis V
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-5; ISBN 978-1-7281-5580-7
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IEEE Trans Electromagn Compat 65 (5): 1282-1291
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2022,
Diao Y, Rashed EA, Hirata A
IEEE Trans Electromagn Compat 64 (6): 1969-1977
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2021,
Diao Y, Li K, Sasaki K, Kodera S, Laakso I, El Hajj W, Hirata A
IEEE Trans Electromagn Compat 63 (5): 1709-1716
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IEEE Trans Electromagn Compat 63 (5): 1690-1698
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2016,
Diao YL, Sun WN, Leung SW, Siu YM, Chan KH
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Shenzhen, China. IEEE: 329-331; ISBN 978-1-4673-9494-9
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2014,
Diao YL, Sun WN, Chan KH, Leung SW, Siu YM
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 226-229; ISBN 978-4-88552-287-1
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2020,
Dinarević EC, Poljak D, Blažević Z
2020 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Hvar, Croatia. IEEE: 1-4; ISBN 978-1-7281-7538-6
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2014,
Döbbelin R, Förster S, Lindemann A
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 369-374; ISBN 978-1-4799-3226-9
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2018,
Douglas MG, Pfeifer S, Kuehn S, Neufeld E, Pokovic K, Carrasco E, Samaras T, Christ A, Capstick M, Kuster N
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 92-94; ISBN 978-1-5090-3955-5
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2018,
Drandić A, Trkulja B
Engineering Analysis with Boundary Elements 91: 1-6
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2022,
Duris V, Ivanov VN, Chumarov SG
TEM J 11 (2): 920-925
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2017,
Dürrenberger G, Leuchtmann P, Röösli M, Siegrist M, Sütterlin B
Swiss Federal Office of Energy (SFOE),
Statusbericht 2017: 1-125
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2016,
Dürrenberger G, Leuchtmann P, Röösli M, Siegrist M, Sütterlin B
Swiss Federal Office of Energy (SFOE),
Statusbericht 2016: 1-113