The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2020,
Hong S, Jeong S, Lee S, Sim B, Kim H, Kim J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 623-625; ISBN 978-1-7281-7431-0
-
2020,
Yang R, Zheng J, Song S, Guo R, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 261-265; ISBN 978-1-7281-7431-0
-
2020,
Yang X, Zheng J, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 266-269; ISBN 978-1-7281-7431-0
-
2020,
Rumeng T, Ying S, Tong W, Wentao Z
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 659-662; ISBN 978-1-7281-7431-0
-
2020,
Gao Z, Zhang W, Chen X
Zhongguo Yi Liao Qi Xie Za Zhi 44 (4): 302-306
-
2020,
Titov EV, Soshnikov AA, Drobyazko ON
2020 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM), Sochi, Russia. IEEE: 1-5; ISBN 978-1-7281-4591-4
-
IEEE Electromagn Compat Mag 9 (2): 27-29
-
IEEE Trans Electromagn Compat 62 (4): 1443-1450
-
2020,
Brizi D, Fontana N, Tucci M, Barmada S, Monorchio A
IEEE Trans Electromagn Compat 62 (4): 1312-1322
-
2020,
Rashed EA, Diao Y, Tanaka S, Sakai T, Gomez-Tames J, Hirata A
IEEE Trans Electromagn Compat 62 (6): 2704-2713