The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2003,
Ruddle AR, Topham DA, Ward DD
2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446), Boston, MA, USA. volume 2; IEEE: 543-547; ISBN 978-0-7803-7835-3
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2020,
Rumeng T, Ying S, Tong W, Wentao Z
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 659-662; ISBN 978-1-7281-7431-0
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2017,
Rumeng T, Senwen L, Tong W, Shaochuan C
2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing), Beijing, China. IEEE: 1-5; ISBN 978-1-5090-5186-1
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1994,
Ruppe I, Eggert S, Goltz S, Hentschel K
Federal Institute for Occupational Safety and Health and Occupational Medicine (BAuA),
Ergebnisbericht, 11.002: 1-84
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2018,
Sadamitsu S, Leung SW, Lo WK, Sun WN
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 28-31; ISBN 978-1-5090-3955-5
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2016,
Salcedo JD, Pretorius VG, Hsu JC, Lalani GG, Schricker AA, Hebsur SM, McGARRY TJ, Hunter JA, Lewis KE, Krummen DE, Feld GK, Birgersdotter-Green U
Pacing Clin Electrophysiol 39 (11): 1254-1260
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2007,
Samaras T, Kalampaliki E, Sahalos JN
IEEE Trans Electromagn Compat 49 (4): 936-939
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2002,
Santomauro M, Da Prato D, Ottaviano L, Borrelli A, Chiariello M
Ital Heart J Suppl 3 (4): 440-445
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2021,
Sârbu A, Miclăuș S, Șorecău E, Bechet P
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 243-248; ISBN 978-1-6654-4889-5
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2021,
Sasaki K, Kawabata K, Shimizu Y, Watanabe S, Wake K, Suga R, Hashimoto O
IEEE Trans Electromagn Compat 63 (5): 1631-1639