The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2014,
Laakso I, Hirata A, Fujiwara O
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 202-205; ISBN 978-4-88552-287-1
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2014,
Sunohara T, Laakso I, Hirata A, Onishi T
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 449-452; ISBN 978-4-88552-287-1
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2014,
Nagaoka T, Watanabe S, Niwa T
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 190-193; ISBN 978-4-88552-287-1
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2014,
Sasaki K, Nagaoka T, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 537-540; ISBN 978-4-88552-287-1
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2014,
Tateno A, Tanaka K, Nagaoka T, Watanabe S, Saito K, Takahashi M, Ito K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 186-189; ISBN 978-4-88552-287-1
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2014,
Wiart J, Conil E, Varsier N, Sarrebourse T, Hadjem A, Martens L, Wermeeren G, Corre Y
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 635-637; ISBN 978-4-88552-287-1
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2014,
Shiina T, Suzuki Y, Kasai Y, Inami Y, Taki M, Wake K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 166-169; ISBN 978-4-88552-287-1
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2014,
Chakarothai J, Suzuki Y, Taki M, Kojima M, Sasaki K, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 182-185; ISBN 978-4-88552-287-1
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2014,
Cabot E, Zastrow E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 237-240; ISBN 978-4-88552-287-1
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2014,
Choi DG, Kim KH, Jang JD, Chung SY, Gimm YM
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 638-641; ISBN 978-4-88552-287-1