The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2023,
Xinhua P, Xin Z, Huixiong H, Qingfei S, Anxiang L, Wei T, Chao Y, Tong W
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-5; ISBN 9798350333114
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2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-4; ISBN 9798350333114
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2023,
Wu J, Ye J, Zou J, Gao J, Cui K
IEEE Access 11: 134191-134198
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2023,
Giurgiuman A, Gliga M, Bojita A, Andreica S, Munteanu C, Topa V, Constantinescu C, Pacurar C
Technologies 11 (6): 159
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IEEE Trans Electromagn Compat [in press]
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2023,
Karpowicz J, Gryz K, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-5; ISBN 9798350324013
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2023,
Voicu V, Dina LA, Dumbrava I, Mircea PM, Fieraru I
2023 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: 1-6; ISBN 9798350315257
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2023,
Vivarelli C, Censi F, Calcagnini G, Mattei E
2023 53rd European Microwave Conference (EuMC), Berlin, Germany. IEEE: 263-266; ISBN 9798350347395
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2023,
Nazemi M, Dommerque R, Daniel S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2023,
Yamaguchi-Sekino S, Ikuyo M, Kamegai K, Taki M, Onishi T, Watanabe S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2023,
Gryz K, Karpowicz J, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-5; ISBN 9798350324013
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2023,
Ramos V, Suárez SD, Marina P, Febles VM, Rabassa LE, Hernández JA
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2023,
Muramatsu D, Kodama M
AIP Adv 13 (8): 085022
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2023,
Hwata C, Rushingabigwi G, Gatera O, Twizere C, Mukanyiligira D, Thomas BN
2023 Photonics & Electromagnetics Research Symposium (PIERS), Prague, Czech Republic. IEEE: 1389-1396; ISBN 9798350312850
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2023,
Kataja J, Nissi J, Roine T, Laakso I
IEEE Trans Electromagn Compat 65 (6): 1647-1655
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2023,
Kirawanich P, Dey P, Sumpavakup C
IEEE Trans Transp Electrif [in press]
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2023,
Voicu V, Dina LA, Mircea PM, Dumbrava I
2023 Power Quality and Electromagnetic Compatibility at Low Frequency (PQEMC-LF), Craiova, Romania. IEEE: 61-64; ISBN 9798350341348
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2023,
Kuchina AP, Zakirova EA
2023 Systems of Signal Synchronization, Generating and Processing in Telecommunications (SYNCHROINFO), Pskov, Russian Federation. IEEE: 1-4; ISBN 9798350348323
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IEEE Trans Electromagn Compat 65 (5): 1282-1291
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2023,
Souček T, Richter A, Morava J, Slavík L
2023 5th International Congress on Human-Computer Interaction, Optimization and Robotic Applications (HORA), Istanbul, Turkiye. IEEE: 1-4; ISBN 9798350337532
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2023,
Campi T, Cruciani S, Maradei F, Feliziani M
Energies 16 (9): 3822
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2023,
Shikhantsov S, Thielens A, Vermeeren G, Demeester P, Martens L, Joseph W
IEEE Trans Electromagn Compat 65 (4): 960-971
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IEEE Trans Electromagn Compat 65 (4): 1090-1097
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2023,
Yao M, Zhekov SS, Xu B, Li K, Zhang S
IEEE Trans Electromagn Compat 65 (5): 1292-1299
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2023,
Li Y, Ying Y, Xie K, Pan S
IEEE Trans Electromagn Compat 65 (3): 643-654