The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2022,
Marina P, Suárez SD, Hernández JA, Febles VM, Rabassa LE, Ramos V
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 519-524; ISBN 978-1-6654-0789-2
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2014,
Marshman CA, Armstrong R, Dawson L, Rowell AJ, Ruddle AR
5th IET Hybrid and Electric Vehicles Conference (HEVC 2014), London, UK. IET: 14737980; ISBN 978-1-84919-911-7
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2017,
Masumnia-Bisheh K, Ghaffari-Miab M, Zakeri B
IEEE Trans Electromagn Compat 59 (2): 509 - 517
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2003,
Matsumoto Y, Takeuchi M, Fujii K, Sugiura A, Yamanaka Y
IEEE Trans Electromagn Compat 45 (3): 561-566
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2021,
Matsuzawa S-i, Kojima T, Mizuno K, Kagawa K, Wakamatsu A
IEEE Trans Electromagn Compat 63 (6): 1896-1903
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2016,
Mattei E, Lucano E, Censi F, Triventi M, Calcagnini G
IEEE Trans Electromagn Compat 58 (1): 314-322
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2012,
Mattei E, Censi F, Triventi M, Bartolini P, Calcagnini G
Expert Rev Med Devices 9 (3): 289-297
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2013,
Melia GCR, Robinson MP, Flintoft ID, Marvin AC, Dawson JF
IEEE Trans Electromagn Compat 55 (6): 1043-1050
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2018,
Mengjun W, Jun Z, Hongxing Z, Mengjun W, Lulu C, Ze Y, Ping M, Hongxing Z
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 981-985; ISBN 978-1-5090-3955-5
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2004,
Metwally IA, Zischank WJ, Heidler FH
IEEE Trans Electromagn Compat 46 (2): 208-221
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Energies 17 (1): 126
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2017,
Mishra SK, Chowdhary R, Kumari S, Rao SB
J Clin of Diagn Res 11 (5): ZE01-ZE05
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2021,
Miwa K, Suzuki Y, Lan J, Diao Y, Hirata A
IEEE Trans Electromagn Compat 63 (5): 1640-1648
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2020,
Miwa K, Takenaka T, Hirata A
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-4; ISBN 978-1-7281-5580-7
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2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
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2014,
Miyaji Y, Shimada M, Mizuno Y, Naito K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 621-624; ISBN 978-4-88552-287-1
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2007,
Mochizuki S, Wakayanagi H, Hamada T, Watanabe S, Taki M, Yamanaka Y, Shirai H
IEEE Trans Electromagn Compat 49 (3): 512-518
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2016,
Mohamed AAS, Berzoy A, Mohammed OA
2016 IEEE Vehicle Power and Propulsion Conference (VPPC), Hangzhou, China. IEEE: 1-6; ISBN 978-1-5090-3529-8
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2021,
Mohd Baharin RH, Omi S, Uno T, Arima T
IEEE Trans Electromagn Compat 63 (5): 1658-1666
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2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 525-530; ISBN 978-1-6654-0789-2
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2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: 82-87; ISBN 978-1-7281-0595-6
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2018,
Munhoz-Rojas PE, Segura-Salas CS, Costa AA, Martins R, Hoffmann-Neto J
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 1267-1273; ISBN 978-1-5090-3955-5
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2023,
Muramatsu D, Kodama M
AIP Adv 13 (8): 085022
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2003,
Nadi M, Hedjiedj A, Joly L, Schmitt P, Dodinot B, Aliot E
Arch Mal Coeur Vaiss 96 (Spec. III): 22-29
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2015,
Nagaoka T, Niwa T, Watanabe S
2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), Taipei, Taiwan. IEEE: 444-447; ISBN 978-1-4799-6668-4