The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2018,
Chen J, Ruddle AR, Xian Teo Y
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 860-865; ISBN 978-1-4673-9699-8
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2018,
Aga K, Hirata A, Laakso I
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 515-520; ISBN 978-1-4673-9699-8
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2018,
Karpowicz J, De Miguel-Bilbao S, Zradzńnski P, Gryz K, Falcone F, Ramos V
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 972-975; ISBN 978-1-4673-9699-8
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2018,
Isrie S, Moonen N, Schipper H, Bergsma H, Lefcrink F
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 500-505; ISBN 978-1-4673-9699-8
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2018,
De Miguel-Bilbao S, Blas J, Falcone F, Ramos V
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 510-514; ISBN 978-1-4673-9699-8
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2018,
Sato K, Tsukahara T, Kamimura Y
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 506-509; ISBN 978-1-4673-9699-8
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2018,
Kamimura Y, Inagaki S, Wake K
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 855-859; ISBN 978-1-4673-9699-8
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2018,
Paganoto PS, Hagedorn MP, da Silva JR
2017 IEEE 3rd Global Electromagnetic Compatibility Conference (GEMCCON), Sao Paulo, Brazil. IEEE: 1-5; ISBN 978-1-5386-2992-5
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2018,
Kosterec M, Kurimský J, Vargová B
2018 19th International Scientific Conference on Electric Power Engineering (EPE), Brno, Czech Republic. IEEE: 1-6; ISBN 978-1-5386-4613-7
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2018,
Vargová B, Majláth I, Kurimský J, Cimbala R, Kosterec M, Tryjanowski P, Jankowiak Ł, Raši T, Majláthová V
Exp Appl Acarol 75 (1): 85-95
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2018,
Zhang K, Du L, Zhu Z, Song B, Xu D
IEEE Trans Electromagn Compat 60 (4): 829 - 839
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2018,
Gomez-Tames J, Laakso I, Haba Y, Hirata A, Poljak D, Yamazaki K
IEEE Trans Electromagn Compat 60 (3): 589 - 597
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2018,
Poljak D, Cvetković M, Bottauscio O, Hirata A, Laakso I, Neufeld E, Reboux S, Warren C, Giannopolous A, Costen F
IEEE Trans Electromagn Compat 60 (2): 328 - 337
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2017,
Campi T, Cruciani S, Maradei F, Feliziani M
IEEE Trans Electromagn Compat 59 (2): 686-694
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2017,
Jin L, Peng C, Jiang T
IEEE Trans Electromagn Compat 59 (4): 1095-1102
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2017,
Vargova B, Kurimsky J, Cimbala R, Kosterec M, Majlath I, Pipova N, Tryjanowski P, Jankowiak L, Majlathova V
Syst Appl Acarol 22 (5): 683-693
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2017,
Masumnia-Bisheh K, Ghaffari-Miab M, Zakeri B
IEEE Trans Electromagn Compat 59 (2): 509 - 517
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2017,
Yavolovskaya E, Gabriadze G, Chiqovani G, Jobava R
2017 XXIInd International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory (DIPED), Dnipro. IEEE, Dnipro, Ukraine: 183-186; ISBN 978-1-5090-0605-2
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2017,
Gercek C, Magne I, Kourtiche D, Schmitt P, Roth P, Nadi M, Souques M
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France: 1-5; ISBN 978-1-5386-0689-6
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2017,
Campi T, Cruciani S, De Santis V, Maradei F, Feliziani M
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France: 1-6; ISBN 978-1-5386-0689-6
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2017,
Park BS, Razjouyan A, Angelone LM, McCright B, Rajan SS
IEEE Trans Electromagn Compat 59 (5): 1390-1399
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2017,
Yang R, Zheng J, Chen J, Kainz W
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA. IEEE; ISBN 978-1-5386-2232-2
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2017,
Oganezova I, Pommerenke D, Zhou J, Ghosh K, Hosseinbeig A, Lee J, Tsitskishvili N
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA. IEEE; ISBN 978-1-5386-2232-2
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2017,
Hikage T, Yamagishi M, Shindo K, Nojima T
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, Korea (South). IEEE; ISBN 978-1-5386-3913-9
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2017,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong R
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, Korea (South). IEEE; ISBN 978-1-5386-3913-9