The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2015,
Frikha A, Bensetti M, Pichon L, Lafon F, Duval F, Benjelloun N
IEEE Trans Electromagn Compat 57 (6): 1481-1490
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2015,
Costea M, Baran I, Leonida T
2015 9th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest. IEEE: 331-336; ISBN 978-1-4799-7514-3
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2015,
Seckler T, Jagielski K, Stunder D
Int J Environ Res Public Health 12 (6): 5886-5904
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2015,
Chakarothai J, Shi J, Wang J, Fujiwara O, Wake K, Watanabe S
IEEE Electromagn Compat Mag 4 (1): 57-66
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2015,
Lee WS, Oh KS, Yu JW
IEEE Antennas Wirel Propag Lett 14: 1459-1462
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2015,
Vassilev A, Ferber A, Wehrmann C, Pinaud O, Schilling M, Ruddle AR
IEEE Trans Electromagn Compat 57 (6): 35-43
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2015,
Ardavan M, Trueman CW, Schmitt KA
IEEE Trans Electromagn Compat 57 (6): 69-79
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2015,
Bamba A, Gaillot DP, Tanghe E, Vermeeren G, Joseph W, Lienard M, Martens L
IEEE Trans Electromagn Compat 57 (6): 27-34
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2014,
Carsimamovic A, Mujezinovic A, Carsimamovic S, Muharemovic A, Bajramovic Z
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 611-614; ISBN 978-1-4799-3226-9
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2014,
Laissaoui AM, Nekhoul B, Poljak D, Kerroum K, Drissi KE
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 974-979; ISBN 978-1-4799-3226-9
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2014,
Yngve Hamnerius, Tomas Nilsson
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 364-368; ISBN 978-1-4799-3226-9
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2014,
Döbbelin R, Förster S, Lindemann A
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 369-374; ISBN 978-1-4799-3226-9
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2014,
Lisewski T, Luszcz J
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 360-363; ISBN 978-1-4799-3226-9
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2014,
Ptitsyna NG, Ponzetto A, Kopytenko YA, Ismagilov VS, Korobeinikov AG
J Sci Res Rep 3 (13): 1753 - 1770
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 354-359; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 348-353; ISBN 978-4-88552-287-1
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2014,
Haridim M, Levin B, Revich S, Chulski S, Sauleau R, Zemach R
IEEE Electromagn Compat Mag 3 (4): 43-48
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 745-748; ISBN 978-4-88552-287-1
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2014,
Diao YL, Sun WN, Chan KH, Leung SW, Siu YM
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 226-229; ISBN 978-4-88552-287-1
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2014,
Laakso I, Hirata A, Fujiwara O
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 202-205; ISBN 978-4-88552-287-1
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2014,
Sunohara T, Laakso I, Hirata A, Onishi T
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 449-452; ISBN 978-4-88552-287-1
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2014,
Nagaoka T, Watanabe S, Niwa T
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 190-193; ISBN 978-4-88552-287-1
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2014,
Sasaki K, Nagaoka T, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 537-540; ISBN 978-4-88552-287-1
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2014,
Tateno A, Tanaka K, Nagaoka T, Watanabe S, Saito K, Takahashi M, Ito K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 186-189; ISBN 978-4-88552-287-1
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2014,
Wiart J, Conil E, Varsier N, Sarrebourse T, Hadjem A, Martens L, Wermeeren G, Corre Y
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 635-637; ISBN 978-4-88552-287-1