The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2010,
Seidman SJ, Brockman R, Lewis BM, Guag J, Shein MJ, Clement WJ, Kippola J, Digby D, Barber C, Huntwork D
Heart Rhythm 7 (1): 99-107
-
2007,
Seidman SJ, Ruggera PS, Brockman RG, Lewis B, Shein MJ
Int J Radio Freq Ident Tech Appl 1 (3): 237-246
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2002,
Seker SS, Demirbilek BO, Morgul A
2002 IEEE International Symposium on Electromagnetic Compatibility, Minneapolis, MN, USA. volume 2; IEEE: 662-666; ISBN 978-0-7803-7264-1
-
2019,
Sekiba Y, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 83-86; ISBN 978-1-7281-1639-6
-
2017,
Senic D, Sarolic A, Holloway CL, Ladbury JM
IEEE Trans Electromagn Compat 59 (3): 813 - 822
-
2016,
Senic D, Sarolic A, Joskiewicz ZM, Holloway CL
IEEE Trans Electromagn Compat 58 (3): 721-728
-
2022,
Shah IA, Basir A, Cho Y, Yoo H
IEEE Trans Electromagn Compat 64 (3): 640-649
-
2021,
Shah IA, Cho Y, Yoo H
IEEE Trans Electromagn Compat 63 (3): 681-691
-
IEEE Trans Electromagn Compat 62 (2): 338-345
-
International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, 2012. IEEE: 1-4; ISBN 978-1-4673-0717-8
-
2017,
Shi J, Chakarothai J, Wang J, Wake K, Fujiwara O, Watanabe S
2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing), Beijing, China. IEEE; ISBN 978-1-5090-5186-1
-
2021,
Shiina T, Kudo T, Herai D, Kuranari Y, Sekiba Y, Yamazaki K
IEEE Trans Electromagn Compat 63 (6): 1812-1819
-
2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 744-747; ISBN 978-1-7281-1639-6
-
2014,
Shiina T, Suzuki Y, Kasai Y, Inami Y, Taki M, Wake K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 166-169; ISBN 978-4-88552-287-1
-
2023,
Shikhantsov S, Thielens A, Vermeeren G, Demeester P, Martens L, Joseph W
IEEE Trans Electromagn Compat 65 (4): 960-971
-
2014,
Shimizu HO, Shimizu K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 162-165; ISBN 978-4-88552-287-1
-
1999,
Shimizu HO, Shimizu K
1999 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.99EX147), Tokyo, Japan. IEEE: 169-172; ISBN 978-4-9980748-4-7
-
River Publishers Series in Communications; Shinohara N (ed.): River Publishers, Gistrup, Denmark; ISBN 978-87-93609-24-2
-
2005,
Shizeng W, Zhaojin C, Changzhe W, Jing Y
2005 IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, Beijing, China. volume 1; IEEE: 605-609; ISBN 978-0-7803-9128-4
-
2019,
Shoaib N, Zaidi SNF, Shafqat A, Cheema HM
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), Hangzhou, China. IEEE: 210-212; ISBN 978-1-7281-4263-0
-
2022,
Silla G, Bastianelli L, Colella E, Moglie F, Primiani VM
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 151-156; ISBN 978-1-6654-0789-2
-
2020,
Simonazzi M, Sandrolini L, Reggiani U
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-5; ISBN 978-1-7281-5580-7
-
2019,
Škiljo M, Blažević Z, Poljak D
2019 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: 1-5; ISBN 978-1-7281-3711-7
-
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: 306-308; ISBN 978-1-6654-1672-6
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2021,
Song X, Li R, Yue Y, Wan S
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: 1-4; ISBN 978-1-7281-7622-2