The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 449-454; ISBN 978-1-4673-4980-2
-
2013,
Hirata A, Tsuchida S, Laaskso I
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 89-92; ISBN 978-1-4673-4980-2
-
2013,
Hikage T, Kawamura Y, Nojima T, Nagaoka T, Watanabe S
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 165-168; ISBN 978-1-4673-4980-2
-
2013,
Ruddle AR, Low L, Vassilev A
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 78-83; ISBN 978-1-4673-4980-2
-
2013,
Julstrom SD, Kozma-Spytek LK, Beard BB
IEEE Electromagn Compat Mag 2 (2): 69-81
-
2013,
Bullo M, Dughiero F, Sieni E
IEEE Electromagn Compat Mag 2 (2): 49-58
-
IEEE Electromagn Compat Mag 2 (4): 71
-
2013,
Melia GCR, Robinson MP, Flintoft ID, Marvin AC, Dawson JF
IEEE Trans Electromagn Compat 55 (6): 1043-1050
-
IEEE Trans Electromagn Compat 55 (2): 275-287
-
2013,
Christ A, Douglas MG, Roman JM, Cooper EB, Sample AP, Waters BH, Smith JR, Kuster N
IEEE Trans Electromagn Compat 55 (2): 265-274
-
2012,
Leung SW, Diao Y, Chan KH, Siu YM, Wu Y
IEEE Trans Biomed Eng 59 (10): 2905-2912
-
2012 Asia-Pacific Symposium on Electromagnetic Compatibility, Singapore, 2012. IEEE: 737-740; ISBN 978-1-4577-1557-0
-
2012,
Kim BC, Yun JH, Park SO
IEEE Trans Electromagn Compat 54 (2): 246 - 253
-
2012,
Baskourelos K, Samaras T
IEEE Trans Electromagn Compat 54 (6): 1310 - 1313
-
2012,
Leitgeb N, Niedermayr F, Fuchs C
J Electromagn Anal 4 (2): 353-357
-
2012,
Nicolopoulou EP, Gonos IF, Stathopulos IA, Karabetsos E
IEEE Electromagn Compat Mag 1 (2): 50-59
-
2012,
Bamba A, Joseph W, Andersen JB, Tanghe E, Vermeeren G, Plets D, Nielsen JO, Martens L
IEEE Trans Electromagn Compat 54 (4): 747-757
-
2012,
Leitgeb N, Niedermayr F, Neubauer R
Biomed Tech 57 (3): 201-206
-
2012,
Leitgeb N, Niedermayr F, Neubauer R, Loos G
J Electromagn Anal 4 (2): 96-100
-
IEEE Trans Electromagn Compat 53 (3): 619 - 627
-
2011,
Pignari SA, Spadacini G, Fedeli E
IEEE Trans Electromagn Compat 53 (3): 638-644
-
International Organization for Standardization (ISO), International Electrotechnical Commission (IEC),
ISO/IEC TR 20017:2011: 1-56
-
2011,
Gosselin MC, Vermeeren G, Kuhn S, Kellerman V, Benkler S, Uusitupa TMI, Joseph W, Gati A, Wiart J, Meyer FJC, Martens L, Nojima T, Hikage T, Balzano Q, Christ A, Kuster N
IEEE Trans Electromagn Compat 53 (4): 909-922
-
2011,
Barbiroli M, Carciofi C, Guiducci D
IEEE Trans Electromagn Compat 53 (1): 219-228
-
2011,
Piuzzi G, Bernardi P, Cavagnaro M, Pisa S, Lin JC
IEEE Trans Electromagn Compat 53 (1): 38-47