The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2023,
Xu Z, Rodriguez-Villegas E
IEEE Trans Biomed Circuits Syst [in press]
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2023,
Yamaguchi-Sekino S, Ikuyo M, Kamegai K, Taki M, Onishi T, Watanabe S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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Nihon Hoshasen Gijutsu Gakkai Zasshi 64 (7): 897-901
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2004,
Yamazaki K, Kawamoto T, Fujinami H, Shigemitsu T
IEEE Trans Electromagn Compat 46 (1): 115-120
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2022,
Yang B, Chen CH, Graham SJ
IEEE Letters on Electromagnetic Compatibility Practice and Applications 4 (3): 83-87
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2021,
Yang C, Schierholz M, Trunczik E, Helmich LM, Brüns HD, Schuster C
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 697-702; ISBN 978-1-6654-4889-5
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2020,
Yang R, Zheng J, Song S, Guo R, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 261-265; ISBN 978-1-7281-7431-0
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2019,
Yang R, Zheng J, Wang Y, Guo R, Kainz W, Chen J
IEEE Trans Electromagn Compat 61 (6): 1726 - 1732
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2017,
Yang R, Zheng J, Chen J, Kainz W
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA. IEEE; ISBN 978-1-5386-2232-2
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2021,
Yang W, Chen Q, Xu H, Li Y, Liang W, Dawalibi FP
2021 4th International Conference on Energy, Electrical and Power Engineering (CEEPE), Chongqing, China. IEEE: 599-604; ISBN 978-1-6654-3364-8
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2016,
Yang W, Hu Y, Gao X, Hu K, Xiao F, Cao C
IEEE Trans Electromagn Compat 58 (6): 1772-1775
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2022,
Yang X, Guo R, Zheng J, Chen J
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: 606-609; ISBN 978-1-6654-0930-8
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2021,
Yang X, Zheng J, Chen J
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 703-706; ISBN 978-1-6654-4889-5
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2020,
Yang X, Zheng J, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 266-269; ISBN 978-1-7281-7431-0
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2024,
Yao A, Pei Y, He J, Wang J, Yang P
IEEE Trans Electromagn Compat 66 (2): 405-416
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2017,
Yao L, Shen T, Kang N, Huang J, Liu D, Zhang F, Sun H
IEEE Trans Electromagn Compat 59 (2): 352 - 359
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2024,
Yao M, Pedersen GF, Zhang S
IEEE Trans Electromagn Compat [in press]
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2023,
Yao M, Zhekov SS, Xu B, Li K, Zhang S
IEEE Trans Electromagn Compat 65 (5): 1292-1299
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2017,
Yavolovskaya E, Gabriadze G, Chiqovani G, Jobava R
2017 XXIInd International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory (DIPED), Dnipro. IEEE, Dnipro, Ukraine: 183-186; ISBN 978-1-5090-0605-2
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2017,
Yavolovskaya E, Willmann B, Gabriadze G, Chiqovani G, Sukhiashvili Z, Iosava S, Svanidze L, Jobava R
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
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2016,
Yavolovskaya E, Chiqovani G, Gabriadze G, Iosava S, Svanidze L, Willmann B, Jobava R
2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Wroclaw, Poland. IEEE: 491-196; ISBN 978-1-5090-1417-0
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2014,
Yngve Hamnerius, Tomas Nilsson
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 364-368; ISBN 978-1-4799-3226-9
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2012,
Yoshino Y, Igo S, Katsuragi M, Taki M
International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, 2012. IEEE: 13225679; ISBN 978-1-4673-0717-8
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2019,
Zeng Q, Liu J, Angelone LM, Lloyd T, Wedan S, Chen J, Kainz W
IEEE Trans Electromagn Compat 61 (5): 1423-1431
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2018,
Zeng X, Ma H, Pi C, Yang P, Yan S, Yuan S, Shi J, Zhang Y, Ma L, Pang S
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 24-27; ISBN 978-1-5090-3955-5