The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2019,
Geyikoglu MD, Koc Polat H, Cavusoglu B
2019 Fifth International Electromagnetic Compatibility Conference (EMC Turkiye), Kocaeli, Turkey. IEEE: 1-5; ISBN 978-1-7281-1836-9
-
2020,
Ghnimi S, Gharsallah A
J Electr Syst 16 (1): 134-145
-
2016,
Ghnimi S, Hajri JBR, Harrathi F, Gharsallah A
2016 17th International Conference on Sciences and Techniques of Automatic Control and Computer Engineering (STA), Sousse, Tunisia. IEEE; ISBN 978-1-5090-3408-6
-
2020,
Giaccone L, Cirimele V, Canova A
IEEE Trans Electromagn Compat 62 (1): 83-92
-
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-6; ISBN 978-1-7281-5580-7
-
2022,
Gifuni A, Adil M, Grassini G, Buono A, Nunziata F, Micheli D, Migliaccio M
IEEE Trans Electromagn Compat 64 (4): 951-962
-
2021,
Gifuni A, Grassini G, Buono A, Festa D, Flintoft ID, Gargiulo S, Nunziata F, Migliaccio M
IEEE Trans Electromagn Compat 63 (2): 427-434
-
2005,
Giliberti C, Bedini A, Palomba R, D'Emilia E, Magli CV, Giuliani L
IEEE 6th International Symposium on Electromagnetic Compatibility and Electromagnetic Ecology, 2005, St. Petersburg, Russia. IEEE: 208-212; ISBN 978-0-7803-9374-5
-
2000,
Gilligan P, Somerville S, Ennis JT
Br J Radiol 73 (873): 994-998
-
2023,
Giurgiuman A, Gliga M, Bojita A, Andreica S, Munteanu C, Topa V, Constantinescu C, Pacurar C
Technologies 11 (6): 159
-
2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 162-165; ISBN 978-1-7281-1639-6
-
2019,
Gomez-Tames J, Tarnaud T, Miwa K, Hirata A, Van de Steene T, Martens L, Tanghe E, Joseph W
IEEE Trans Electromagn Compat 61 (6): 1944 - 1952
-
2018,
Gomez-Tames J, Laakso I, Haba Y, Hirata A, Poljak D, Yamazaki K
IEEE Trans Electromagn Compat 60 (3): 589 - 597
-
2017,
Gong Y, Capstick M, Kuehn S, Wilson P, Ladbury J, Koepke G, McCormick DL, Melnick RL, Kuster N
IEEE Trans Electromagn Compat 59 (6): 1798-1808
-
2007,
Gonzalez MC, Peratta A, Poljak D
IEEE Trans Electromagn Compat 49 (1): 153-162
-
2011,
Gosselin MC, Vermeeren G, Kuhn S, Kellerman V, Benkler S, Uusitupa TMI, Joseph W, Gati A, Wiart J, Meyer FJC, Martens L, Nojima T, Hikage T, Balzano Q, Christ A, Kuster N
IEEE Trans Electromagn Compat 53 (4): 909-922
-
2009,
Gosselin MC, Christ A, Kühn S, Kuster N
IEEE Trans Electromagn Compat 51 (2): 227-235
-
2020,
Gravina A, Moglie F, Bastianelli L, Mariani Primiani V
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-6; ISBN 978-1-7281-5580-7
-
2022,
Grazian F, Shi W, Soeiro TB, Dong J, Bauer P
2022 Wireless Power Week (WPW), Bordeaux, France. IEEE: 54-59; ISBN 978-1-6654-8446-6
-
2019,
Grazian F, Shi W, Dong J, van Duijsen P, Soeiro TB, Bauer P
2019 AEIT International Conference of Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE), Torino, Italy. IEEE: 1-5; ISBN 978-1-7281-3278-5
-
IEEE 6th International Symposium on Electromagnetic Compatibility and Electromagnetic Ecology, 2005, St. Petersburg, Russia. IEEE: 9-14; ISBN 978-0-7803-9374-5
-
2007,
Gruber S, Meier M, Moser M, Ryf S, Burgherr R, Fitzpatrick M, Riederer M, Siegenthaler A, Reusser D
Federal Office of Public Health (FOPH),
1-36
-
2023,
Gryz K, Karpowicz J, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-5; ISBN 9798350324013
-
2022,
Gryz K, Karpowicz J, Zradziński P
Sensors 22 (5): 1719
-
2019,
Gryz K, Karpowicz J
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: 1030-1033; ISBN 978-1-7281-0595-6