The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2014,
Shiina T, Suzuki Y, Kasai Y, Inami Y, Taki M, Wake K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 166-169; ISBN 978-4-88552-287-1
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2014,
Chakarothai J, Suzuki Y, Taki M, Kojima M, Sasaki K, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 182-185; ISBN 978-4-88552-287-1
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2014,
Cabot E, Zastrow E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 237-240; ISBN 978-4-88552-287-1
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2014,
Choi DG, Kim KH, Jang JD, Chung SY, Gimm YM
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 638-641; ISBN 978-4-88552-287-1
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2014,
Kim HS, Lee YH, Choi HD, Lee AK, Lee YS, Pack JK, Kim N, Ahn YH
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 170-173; ISBN 978-4-88552-287-1
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2014,
Suzuki Y, Koike A, Takamura M, Taki M, Kojima M, Sasaki K, Chakarothai J, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 832-835; ISBN 978-4-88552-287-1
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2014,
Neufeld E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 230-233; ISBN 978-4-88552-287-1
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2014,
Laakso I, Shimamoto T, Hirata A, Feliziani M
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 430-433; ISBN 978-4-88552-287-1
-
2014,
Kang WG, Alexander Z, Jun HY, Park YH, Pack JK
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 198-201; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 194-197; ISBN 978-4-88552-287-1
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2014,
Arima T, Uno T, Wake K, Fujii K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 529-532; ISBN 978-4-88552-287-1
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2014,
Shimizu HO, Shimizu K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 162-165; ISBN 978-4-88552-287-1
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2014,
Higashiyama J, Tarusawa Y
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 650-653; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 625-628; ISBN 978-4-88552-287-1
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2014,
Miyaji Y, Shimada M, Mizuno Y, Naito K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 621-624; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 206-209; ISBN 978-4-88552-287-1
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2014,
Bieth F, Schunck T, Pinguet S, Delmote P
IEEE Trans Electromagn Compat 56 (4): 964-969
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2014,
Seidman S, LaSorte N
IEEE Electromagn Compat Mag 3 (3): 49-54
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2014,
Chen XL, Umenei AE, Baarman DW, Chavannes N, De Santis V, Mosig JR, Kuster N
IEEE Trans Electromagn Compat 56 (5): 1027-1034
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2014,
Seidman SJ, Pantchenko O, Tennakoon D
IEEE Electromagn Compat Mag 3 (1): 70-74
-
2014,
Le DT, Iyama T, Hamada L, Watanabe S, Onishi T
IEEE Electromagn Compat Mag 3 (1): 57-64
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2014,
Colombi D, Thors B, Jonsson BLG
IEEE Trans Electromagn Compat 56 (3): 539-548
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2013 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), Melbourne, VIC. IEEE: 1-6; ISBN 978-1-5090-1885-7
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2013 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), Melbourne, VIC. IEEE: 1-4; ISBN 978-1-5090-1885-7
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2013,
Higashiyama J, Tarusawa Y
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 93-98; ISBN 978-1-4673-4980-2
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International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 449-454; ISBN 978-1-4673-4980-2
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2013,
Hirata A, Tsuchida S, Laaskso I
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 89-92; ISBN 978-1-4673-4980-2
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2013,
Hikage T, Kawamura Y, Nojima T, Nagaoka T, Watanabe S
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 165-168; ISBN 978-1-4673-4980-2
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2013,
Ruddle AR, Low L, Vassilev A
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 78-83; ISBN 978-1-4673-4980-2
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2013,
Julstrom SD, Kozma-Spytek LK, Beard BB
IEEE Electromagn Compat Mag 2 (2): 69-81
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2013,
Bullo M, Dughiero F, Sieni E
IEEE Electromagn Compat Mag 2 (2): 49-58
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IEEE Electromagn Compat Mag 2 (4): 71
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2013,
Melia GCR, Robinson MP, Flintoft ID, Marvin AC, Dawson JF
IEEE Trans Electromagn Compat 55 (6): 1043-1050
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IEEE Trans Electromagn Compat 55 (2): 275-287
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2013,
Christ A, Douglas MG, Roman JM, Cooper EB, Sample AP, Waters BH, Smith JR, Kuster N
IEEE Trans Electromagn Compat 55 (2): 265-274
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2012,
Leung SW, Diao Y, Chan KH, Siu YM, Wu Y
IEEE Trans Biomed Eng 59 (10): 2905-2912
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2012 Asia-Pacific Symposium on Electromagnetic Compatibility, Singapore, 2012. IEEE: 737-740; ISBN 978-1-4577-1557-0
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2012,
Kim BC, Yun JH, Park SO
IEEE Trans Electromagn Compat 54 (2): 246 - 253
-
2012,
Baskourelos K, Samaras T
IEEE Trans Electromagn Compat 54 (6): 1310 - 1313
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2012,
Leitgeb N, Niedermayr F, Fuchs C
J Electromagn Anal 4 (2): 353-357
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2012,
Nicolopoulou EP, Gonos IF, Stathopulos IA, Karabetsos E
IEEE Electromagn Compat Mag 1 (2): 50-59
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2012,
Bamba A, Joseph W, Andersen JB, Tanghe E, Vermeeren G, Plets D, Nielsen JO, Martens L
IEEE Trans Electromagn Compat 54 (4): 747-757
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2012,
Leitgeb N, Niedermayr F, Neubauer R
Biomed Tech 57 (3): 201-206
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2012,
Leitgeb N, Niedermayr F, Neubauer R, Loos G
J Electromagn Anal 4 (2): 96-100
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IEEE Trans Electromagn Compat 53 (3): 619 - 627
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2011,
Pignari SA, Spadacini G, Fedeli E
IEEE Trans Electromagn Compat 53 (3): 638-644
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International Organization for Standardization (ISO), International Electrotechnical Commission (IEC),
ISO/IEC TR 20017:2011: 1-56
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2011,
Gosselin MC, Vermeeren G, Kuhn S, Kellerman V, Benkler S, Uusitupa TMI, Joseph W, Gati A, Wiart J, Meyer FJC, Martens L, Nojima T, Hikage T, Balzano Q, Christ A, Kuster N
IEEE Trans Electromagn Compat 53 (4): 909-922
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2011,
Barbiroli M, Carciofi C, Guiducci D
IEEE Trans Electromagn Compat 53 (1): 219-228
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2011,
Piuzzi G, Bernardi P, Cavagnaro M, Pisa S, Lin JC
IEEE Trans Electromagn Compat 53 (1): 38-47