The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2014,
Laakso I, Shimamoto T, Hirata A, Feliziani M
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 430-433; ISBN 978-4-88552-287-1
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International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, 2012. IEEE: 13225695; ISBN 978-1-4673-0717-8
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2019,
Lagouanelle P, Krauth VL, Pichon L
2019 AEIT International Conference of Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE), Torino, Italy. IEEE: 1-5; ISBN 978-1-7281-3278-5
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2014,
Laissaoui AM, Nekhoul B, Poljak D, Kerroum K, Drissi KE
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 974-979; ISBN 978-1-4799-3226-9
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2020,
Lämmle T, Parspour N, Mönch M
2020 5th International Conference on Smart and Sustainable Technologies (SpliTech), Split, Croatia. IEEE: 1-6; ISBN 978-1-7281-7363-4
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2022,
Lan J, Diao Y, Duan X, Hirata A
IEEE Trans Electromagn Compat 64 (2): 551-558
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2020,
Lan Q, Zheng J, Chen J, Zhang M
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 270-275; ISBN 978-1-7281-7431-0
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IEEE Trans Electromagn Compat 39 (1): 55-61
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2019,
Le DT, Li K, Watanabe S, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 78-81; ISBN 978-1-7281-1639-6
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2018 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, Boston, MA, USA. IEEE: 783-784; ISBN 978-1-5386-7103-0
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2014,
Le DT, Iyama T, Hamada L, Watanabe S, Onishi T
IEEE Electromagn Compat Mag 3 (1): 57-64
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2015,
Lee AK, Hong SE, Kwon JH, Choi HD
IEEE Trans Electromagn Compat 57 (5): 1281-1284
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IEEE Trans Electromagn Compat 53 (3): 619 - 627
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2007,
Lee AK, Choi HD, Choi JI
IEEE Trans Electromagn Compat 49 (2): 302-312
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2015,
Lee WS, Oh KS, Yu JW
IEEE Antennas Wirel Propag Lett 14: 1459-1462
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 691-694; ISBN 978-1-7281-1639-6
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2017 IEEE Conference on Antenna Measurements & Applications (CAMA), Tsukuba, Japan. IEEE, Tsukuba, Japan: 142-143; ISBN 978-1-5090-5029-1
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2012,
Leitgeb N, Niedermayr F, Fuchs C
J Electromagn Anal 4 (2): 353-357
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2012,
Leitgeb N, Niedermayr F, Neubauer R
Biomed Tech 57 (3): 201-206
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2012,
Leitgeb N, Niedermayr F, Neubauer R, Loos G
J Electromagn Anal 4 (2): 96-100
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2012,
Leung SW, Diao Y, Chan KH, Siu YM, Wu Y
IEEE Trans Biomed Eng 59 (10): 2905-2912
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2016,
Lewicki F, Lugowski A, Zagorda G
2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Wroclaw, Poland. IEEE: 480-484; ISBN 978-1-5090-1417-0
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2023,
Li C, Sha S, Zhao H, Xing L, Xu Q
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-3; ISBN 9798350333114
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IEEE Trans Electromagn Compat 65 (4): 1090-1097
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 206-209; ISBN 978-4-88552-287-1
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2022,
Li E, Li XJ, Seet BC
2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), Chengdu, China. IEEE: 101-104; ISBN 978-1-6654-2776-0
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2022,
Li J, Changyuan W, Yujie Z
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: 261-263; ISBN 978-1-6654-1672-6
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IEEE Trans Electromagn Compat 64 (4): 941-950
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2022,
Li S, Jiang Y, Tang C, Luo Z, Liu L, Li Z, Gu C
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: 563-565; ISBN 978-1-6654-1672-6
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2019,
Li X, Zhu F, Lu H, Qiu R, Tang Y
IEEE Trans Electromagn Compat 61 (2): 319 - 326
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2023,
Li Y, Ying Y, Xie K, Pan S
IEEE Trans Electromagn Compat 65 (3): 643-654
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2022,
Li Y, Liu D, Zhang J, Wu L
2022 International Conference on Mechanical and Electronics Engineering (ICMEE), Xi'an, China. IEEE: 162-166; ISBN 978-1-6654-9221-8
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2016,
Lingdi F, Guizhi X, Hongli Y, Miaomiao G, Ning Y
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Shenzhen, China. IEEE: 1035-1037; ISBN 978-1-4673-9494-9
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2020,
Liorni I, Lisewski T, Capstick MH, Kuehn S, Neufeld E, Kuster N
IEEE Trans Electromagn Compat 62 (4): 1323-1332
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2016,
Lisewski T, Mikolajczyk A, Abramik S, Rucinski M
2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Wroclaw, Poland. IEEE: 497-500; ISBN 978-1-5090-1417-0
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2014,
Lisewski T, Luszcz J
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 360-363; ISBN 978-1-4799-3226-9
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2022,
Liu J, Wang Y, Guo R, Wang Q, Zheng J, Kurpad K, Kainz W, Chen J
IEEE Trans Electromagn Compat 64 (2): 286-294
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2019,
Liu J, Zheng J, Zeng Q, Wang Q, Rondoni J, Olsen J, Kainz W, Chen J
IEEE Trans Electromagn Compat 61 (4): 1091-1097
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2022,
Liu S, Onishi T, Taki M, Watanabe S
IEEE Trans Electromagn Compat 64 (4): 963-974
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2017,
Lopez DG, Ignatenko M, Filipovic DS
IEEE Trans Electromagn Compat 59 (1): 43-47
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2021,
Lottner T, Reiss S, Bitzer A, Bock M, Özen AC
IEEE Trans Electromagn Compat 63 (3): 662-672
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2005,
Loughran SP, Wood AW, Barton JM, Croft RJ, Thompson B, Stough C
NeuroReport 16 (17): 1973-1976
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2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Shenzhen, China. IEEE: 1084-1086; ISBN 978-1-4673-9494-9
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2016,
Luca C, Andriţoi D, Corciovă C, Ciorap R
2016 International Conference and Exposition on Electrical and Power Engineering (EPE), Iasi, Romania. IEEE; ISBN 978-1-5090-6130-3
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1984,
Lucas JH, Johnson MJ
1984 National Symposium on Electromagnetic Compatibility, San Antonio, TX. IEEE: 157-160; ISBN 978-1-5090-3170-2
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2018 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: 693-696; ISBN 978-1-5386-5063-9
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2001,
Lyznicki JM, Altman RD, Williams MA
Biomed Instrum Technol 35 (3): 189-195
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1991,
Ma MT, Larsen EB, Crawford ML
IEEE Trans Electromagn Compat 33 (4): 358-362
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2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Wroclaw, Poland. IEEE: 467-473; ISBN 978-1-5090-1417-0
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2003,
Malaric K, Bartolic J
Turk J Elec Eng & Comp Sci 11 (2): 143-154