The following terms were included:
"vierte Mobilfunk-Generation", 4G, "fourth generation of mobile communications", 第4世代移動通信
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2024,
Dianovský R, Pecho P, Hrúz M, Velký P
2024 New Trends in Civil Aviation (NTCA), Prague, Czech Republic. IEEE: 133-139; ISBN 9798350317961
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2024,
Schiffarth AM, Ta TTJ, Schilling LM, Bornkessel C, Hein M, Heberling D
2024 18th European Conference on Antennas and Propagation (EuCAP), Glasgow, United Kingdom. IEEE: 1-5; ISBN 9798350394436
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2024,
Anwar S, Scialacqua L, Lelievre A, Mantash M, Luc J, Gross N, Saccardi F, Foged LJ
2024 18th European Conference on Antennas and Propagation (EuCAP), Glasgow, United Kingdom. IEEE: 1-4; ISBN 9798350394436
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2024,
Delidimitriou S, Babas D, Samaras T
2024 Panhellenic Conference on Electronics & Telecommunications (PACET), Thessaloniki, Greece. IEEE: 1-4; ISBN 9798350318852
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2023,
Tsuruga S, Omiya M, Miyashita C, Sugimura K, Yamazaki K, Tamura N, Hikage T, Ikeda-Araki A, Kishi R
2023 IEEE International Symposium On Antennas And Propagation (ISAP), Kuala Lumpur, Malaysia. IEEE: 1-2; ISBN 9798350341157
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2023,
El Ghabzouri M, Salhi AE, Mendes PM
2023 IEEE Integrated STEM Education Conference (ISEC), Laurel, MD, USA. IEEE: 410-413; ISBN 9798350300024
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023 IEEE 13th International Conference on Consumer Electronics - Berlin (ICCE-Berlin), Berlin, Germany. IEEE: 216-219; ISBN 9798350324167
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2023,
Gryz K, Karpowicz J, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-5; ISBN 9798350324013
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2023,
Ramos V, Suárez SD, Marina P, Febles VM, Rabassa LE, Hernández JA
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2023,
Shib B, Yeasar SMS, Hassan M, Islam R, Islam AKME
2023 International Conference on Communications, Computing and Artificial Intelligence (CCCAI), Shanghai, China. IEEE: 12-16; ISBN 9798350311303
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2023,
Asadi R, Aliakbarian H, Sahraei A, Yazdani R, Kim DH
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 608-613; ISBN 9798350309775
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2023,
Kopacz T, Schiffarth AM, Wuschek M, Bornkessel C
Landesamt für Natur, Umwelt und Verbraucherschutz Nordrhein-Westfalen (LANUV),
LANUV-Fachbericht 143: 1-138
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2023,
Djuric N, Skoric T, Kljajic D, Otasevic V, Djuric S
2023 Photonics & Electromagnetics Research Symposium (PIERS), Prague, Czech Republic. IEEE: 1856-1861; ISBN 9798350312850
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2023,
Sârbu A, Cotoi A, Vatamanu D, Neghină C, Miclăuş S
2023 10th International Conference on Modern Power Systems (MPS), Cluj-Napoca, Romania. IEEE: 01-05; ISBN 9798350326833
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2023,
Dhanasekar R, Vijayaraja L, Mirthulaa CS, Narenthira Sai Raam PP, Naveen B, Vignesh Kumar C
2023 International Conference on Computer Communication and Informatics (ICCCI), Coimbatore, India. IEEE: 1-6; ISBN 9798350348224
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2023,
Djuric N, Skoric T, Kljajic D, Otasevic V, Djuric S
2023 IEEE Radio and Antenna Days of the Indian Ocean (RADIO), Balaclava, Mauritius. IEEE: 1-2; ISBN 9798350347920
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2023,
Deaconescu DB, Buda AM, Suka D, Miclaus S
2023 13th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest, Romania. IEEE: 1-8; ISBN 9798350331943
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2022,
Meenu L, Aiswarya S, Menon SK, Menon KU
2022 URSI Regional Conference on Radio Science (USRI-RCRS), Indore, India. IEEE: 1-4; ISBN 978-1-6654-5359-2
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French Agency for Food, Environmental and Occupational Health & Safety (ANSES),
ANSES Opinion, Request No 2019-SA-0006: 1-25
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Panagopoulos DJ (ed.): CRC Press, Boca Raton; ISBN 978-1-032-06175-7
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2022,
Kaschel H, Ahumada C
2022 IEEE International Conference on Automation/XXV Congress of the Chilean Association of Automatic Control (ICA-ACCA), Curicó, Chile. IEEE: 1-5; ISBN 978-1-6654-9409-0
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2022,
Pustake S, Upadhyaya V, Bundele M
2022 IEEE Pune Section International Conference (PuneCon), Pune, India. IEEE: 1-7; ISBN 978-1-6654-9898-2
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2022,
Miclaus S, Deaconescu DB, Vatamanu D, Buda AM
2022 International Symposium on Electronics and Telecommunications (ISETC), Timisoara, Romania. IEEE: 1-4; ISBN 978-1-6654-5151-2
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2022,
Nishikawa T, Hikage T, Yamamoto M
2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM), Narashino, Japan. IEEE: 124-125; ISBN 978-1-6654-3239-9
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2022,
Svistunou A, Mordachev V, Sinkevich E, Ye M, Dubovik A, Shakinka I
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 537-542; ISBN 978-1-6654-0789-2