The following terms were included:
"wireless power transfer", "kabellose Leistungsübertragung", "drahtlose Energieübertragung", "induktives Laden", WPT, "inductive charging", "wireless charging", "wireless power"
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2022,
Takahashi R, Yukita W, Yokota T, Someya T, Kawahara Y
Barbosa S, Lampe C, Appert C, Shamma DA, Drucker S, Williamson J, Yatani K (eds.): Proceedings of the 2022 CHI Conference on Human Factors in Computing Systems (CHI' 22). Association for Computing Machinery, New York; 1-12; ISBN 978-1-4503-9157-3
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2022,
Emhemmed AS, Abougarair AJ, Salih O, Alsamlqi SS
2022 IEEE 21st international Ccnference on Sciences and Techniques of Automatic Control and Computer Engineering (STA), Sousse, Tunisia. IEEE: 18-23; ISBN 978-1-6654-8262-2
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2022,
David A, Tiemann M, Schmuelling B, Haussmann N, Stroka S, Clemens M
2022 Second International Conference on Sustainable Mobility Applications, Renewables and Technology (SMART), Cassino, Italy. IEEE: 1-6; ISBN 978-1-6654-7147-3
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2022,
Gonzalez-Hernando F, Jauregi A, Villar I, Rujas A, Mir L
2022 IEEE Energy Conversion Congress and Exposition (ECCE), Detroit, MI, USA. IEEE: 1-7; ISBN 978-1-7281-9388-5
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2022,
Stroka S, Haussmann N, Zang M, Schmuelling B, Clemens M
2022 IEEE 20th Biennial Conference on Electromagnetic Field Computation (CEFC), Denver, CO, USA. IEEE: 1-2; ISBN 978-1-6654-6834-3
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2022,
Karim ML, Bosnjak AM, McLaughlin J, Crawford P, McEneaney D, Escalona OJ
Sensors 22 (20): 7775
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2022,
Marinescu A, Morega M
Rev Roum Sci Techn – Électrotechn et Énerg 67 (2): 213-218
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2022,
Alshhawy S, Barakat A, Pokharel RK, Yoshitomi K
2022 IEEE/MTT-S International Microwave Symposium - IMS 2022, Denver, CO, USA. IEEE: 275-278; ISBN 978-1-6654-9614-8
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2022,
Haider Z, Le Dréan Y, Sauleau R, Caramazza L, Liberti M, Zhadobov M
2022 3rd URSI Atlantic and Asia Pacific Radio Science Meeting (AT-AP-RASC), Gran Canaria, Spain. IEEE: 1-4; ISBN 978-1-6654-9986-6
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2022,
Capstick M, Mischa Sabathy, Brönnimann M, Rivara B, Bruno Klopott, Kühn S, Xi J, Choi D, Kuster N
2022 Wireless Power Week (WPW), Bordeaux, France. IEEE: 68-71; ISBN 978-1-6654-8446-6