-
2022,
Kroll MW, Panescu D, Perkins PE, Koch M, Andrews CJ
2022 44th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Glasgow, Scotland, United Kingdom. IEEE: pp. 1418-1422; ISBN 978-1-7281-2783-5
-
2022,
Quirin T, Vergne C, Féry C, Badertscher P, Nicolas H, Mannhart D, Osswald S, Kuhne M, Sticherling C, Madec M, Hébrard L, Knecht S, Pascal J
2022 IEEE International Symposium on Medical Measurements and Applications (MeMeA), Messina, Italy. IEEE: pp. 1-6; ISBN 978-1-6654-8300-1
-
2021,
Yu Z, Chen JC, He Y, Alrashdan FT, Avants BW, Singer A, Robinson JT, Yang K
2021 IEEE Custom Integrated Circuits Conference (CICC), Austin, TX, USA. IEEE: pp. 1-2; ISBN 978-1-7281-7582-9
-
2021,
Chisholm WA, Nguyen DH
2021 35th International Conference on Lightning Protection (ICLP) and XVI International Symposium on Lightning Protection (SIPDA), Colombo, Sri Lanka. IEEE: pp. 1-3; ISBN 978-1-6654-2347-2
-
2021,
Kroll MW, Hisey DAS, Andrews CJ, Perkins PE, Panescu D
2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Mexico. IEEE: pp. 1462-1467; ISBN 978-1-7281-1179-7
-
2021,
Martinez JA, Cork TE, Chubb H, Vasanawala S, Ennis DB
2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Mexico. IEEE: pp. 5027-5030; ISBN 978-1-7281-1180-3
-
2021,
Zheng C, Chen X, Nguyen BT, Sanpitak P, Vu J, Bagci U, Golestanirad L
2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Mexico. IEEE: pp. 4204-4208; ISBN 978-1-7281-1179-7
-
2021,
Nguyen BT, Bhusal B, Fawcett K, Golestanirad L
2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Mexico. IEEE: pp. 4986-4989; ISBN 978-1-7281-1179-7
-
2021,
Feng Y, Li Z, Chen P, Li G
2021 International Conference on Microwave and Millimeter Wave Technology (ICMMT), Nanjing, China. IEEE: pp. 1-3; ISBN 978-1-6654-3438-6
-
2021,
Klein V, Davids M, Schad LR, Wald LL, Guérin B
2021 International Conference on Electromagnetics in Advanced Applications (ICEAA), Honolulu, HI, USA. IEEE: p. 215; ISBN 978-1-6654-1387-9