The following terms were included:
第4世代移動通信, "vierte Mobilfunk-Generation", 4G, "fourth generation of mobile communications"
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2024,
Delidimitriou S, Babas D, Samaras T
2024 Panhellenic Conference on Electronics & Telecommunications (PACET), Thessaloniki, Greece. IEEE: pp. 1-4; ISBN 9798350318852
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2023,
Elbasheir MS, Saeed RA, Edam S, Khalifa O, Odeh N, Ahmed ZE
2023 IEEE Third International Conference on Signal, Control and Communication (SCC), Hammamet, Tunisia. IEEE: pp. 1-6; ISBN 9798350326406
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2023,
Tsuruga S, Omiya M, Miyashita C, Sugimura K, Yamazaki K, Tamura N, Hikage T, Ikeda-Araki A, Kishi R
2023 IEEE International Symposium On Antennas And Propagation (ISAP), Kuala Lumpur, Malaysia. IEEE: pp. 1-2; ISBN 9798350341157
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2023,
El Ghabzouri M, Salhi AE, Mendes PM
2023 IEEE Integrated STEM Education Conference (ISEC), Laurel, MD, USA. IEEE: pp. 410-413; ISBN 9798350300024
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023 IEEE 13th International Conference on Consumer Electronics - Berlin (ICCE-Berlin), Berlin, Germany. IEEE: pp. 216-219; ISBN 9798350324167
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2023,
Gryz K, Karpowicz J, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-5; ISBN 9798350324013
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2023,
Ramos V, Suárez SD, Marina P, Febles VM, Rabassa LE, Hernández JA
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-6; ISBN 9798350324013
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2023,
Shib B, Yeasar SMS, Hassan M, Islam R, Islam AKME
2023 International Conference on Communications, Computing and Artificial Intelligence (CCCAI), Shanghai, China. IEEE: pp. 12-16; ISBN 9798350311303
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2023,
Asadi R, Aliakbarian H, Sahraei A, Yazdani R, Kim DH
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: pp. 608-613; ISBN 9798350309775
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2023,
Kopacz T, Schiffarth AM, Wuschek M, Bornkessel C
Landesamt für Natur, Umwelt und Verbraucherschutz Nordrhein-Westfalen (LANUV),
LANUV-Fachbericht 143: 1-138