The following terms were included:
血流, Blutströmung, Durchblutung, Blutfluss, "blood perfusion", bloodstream, "blood flow"
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2020,
Bragina OA, Semyachkina-Glushkovskaya OV, Nemoto EM, Bragin DE
Ryu PD, LaManna JC, Harrison DK, Lee SS (eds.): Oxygen Transport to Tissue XLI. Advances in Experimental Medicine and Biology, volume 1232; Springer, New York; pp. 47-53; ISBN 978-3-030-34459-7
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2019,
Tofighi MR, Attaluri A
2019 IEEE MTT-S International Microwave Symposium (IMS), Boston, MA, USA. IEEE: pp. 228-231; ISBN 978-1-7281-1310-4
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2019,
Kageyama I, Masuda H, Morimatsu Y, Ishitake T, Sakakibara K, Hikage T, Hirata A
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 766-769; ISBN 978-1-7281-1639-6
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2018,
Bhangari DS, Bhagali AC, Kshirsagar RV
2018 International Conference on Control, Power, Communication and Computing Technologies (ICCPCCT), Kannur, India. IEEE: pp. 571-574; ISBN 978-1-5386-0797-8
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2018,
Diao Y, Li M, Sun W, Leung SW, Cai Y, Zhu F, Yang Y
2018 12th International Symposium on Medical Information and Communication Technology (ISMICT), Sydney, NSW, Australia. IEEE: pp. 1-3; ISBN 978-1-5386-3390-8
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2018,
Bragin DE, Bragina OA, Hagberg S, Nemoto EM
Heldt T (ed.): Intracranial Pressure & Neuromonitoring XVI. Acta Neurochirurgica Supplement, volume 126; Springer, Cham; pp. 93-95; ISBN 978-3-319-65797-4
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2017,
Okano H, Fujimura A, Ishiwatari H, Watanuki K
2017 IEEE International Conference on Systems, Man, and Cybernetics (SMC), Banff, AB, Canada. IEEE: pp. 2442-2447; ISBN 978-1-5386-1646-8
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2016,
Kanemaki M, Shimizu HO, Kitama M, Yamashita M, Miura H, Shimizu K
2016 Progress in Electromagnetic Research Symposium (PIERS), Shanghai, China. IEEE: pp. 1115-1118; ISBN 978-1-5090-6094-8
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2016 International Conference on ElectroMagnetic Interference & Compatibility (INCEMIC), Bengaluru, India. IEEE; ISBN 978-1-5090-5841-9
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2014,
Ota S, Laakso I, Hirata A
2014 Asia-Pacific Microwave Conference, Sendai, Japan. IEEE: pp. 959-961; ISBN 978-4-902339-31-4