The following terms were included:
Glioblastom, glioblastoma, 神経膠細胞芽腫
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2023,
Rampazzo E, Karim N, Persano L, Pinto R, Casciati A, Tanori M, Hodgkins G, Davies IW, Zambotti A, Hancock C, Palego C, Viola G, Mancuso M, Merla C
2023 IEEE MTT-S International Microwave Biomedical Conference (IMBioC), Leuven, Belgium. IEEE: pp. 73-75; ISBN 978-1-6654-9218-8
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2023 Photonics & Electromagnetics Research Symposium (PIERS), Prague, Czech Republic. IEEE: pp. 1267-1274; ISBN 9798350312850
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2023,
Ravin R, Cai TX, Li A, Briceno N, Pursley RH, Garmendia-Cedillos M, Pohida T, Wang H, Zhuang Z, Cui J, Morgan NY, Williamson NH, Gilbert MR, Basser PJ
bioRxiv: the Preprint Server for Biology (bioRxiv),
2023.01.18.524504
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2021,
Gentilal N, Salvador R, Miranda PC
Brain and Human Body Modeling 2020. Springer, Cham (CH): pp. 37-62; ISBN 978-3-030-45622-1
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2021,
Bomzon Z, Wenger C, Proescholdt M, Mohan S
Brain and Human Body Modeling 2020. Springer, Cham (CH): pp. 3-17; ISBN 978-3-030-45622-1
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Institute for Quality and Efficiency in Health Care (IQWiG),
Rapid Report N18-02 Version 1.1, IQWiG-Berichte – Nr. 772: 1-62
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2016,
Wenger C, Bomzon Z, Salvador R, Basser PJ, Miranda PC
2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Orlando, FL, USA. IEEE: pp. 5664-5667; ISBN 978-1-4577-0220-4
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2016,
Hershkovich HS, Bomzon Z, Wenger C, Urman N, Chaudhry A, Garcia-Carracedo D, Kirson ED, Weinberg U, Wassermann Y, Palti Y
2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Orlando, FL, USA. IEEE: pp. 2357-2360; ISBN 978-1-4577-0220-4
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2016,
Macedo M, Wenger C, Salvador R, Fernandes SR, Miranda PC
2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Orlando, FL, USA. IEEE: pp. 5168-5171; ISBN 978-1-4577-0220-4
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2015,
Bomzon Z, Urman N, Wenger C, Giladi M, Weinberg U, Wasserman Y, Kirson ED, Miranda PC, Palti Y
2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Milan, Italy. IEEE: pp. 6888-6891; ISBN 978-1-4244-9271-8