2019 TEQIP III Sponsored International Conference on Microwave Integrated Circuits, Photonics and Wireless Networks (IMICPW), Tiruchirappalli, India. IEEE: pp. 10-14; ISBN 978-1-7281-1882-6
2019,
Byron K, Winkler SA, Robb F, Vasanawala S, Pauly J, Scott G
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 78-81; ISBN 978-1-7281-1639-6
2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Lausanne, Switzerland. IEEE: pp. 145-148; ISBN 978-1-7281-1202-2
2019,
Konefal-Janocha M, Banas-Zabczyk A, Bester M, Bocak D, Budzik S, Gorny S, Larsen S, Majchrowski K, Cholewa M