-
2021,
Murthy DVB, Kumar A, Reddy CJ
2021 International Applied Computational Electromagnetics Society Symposium (ACES), Hamilton, ON, Canada. IEEE: 1-3; ISBN 978-1-6654-3447-8
-
2022,
Musa U, Mohd Shah S, A Majid H, Zainal Abidin Z, Sani Yahya M, Babani S, Yunusa Z
IEEE Access 10: 121831-121863
-
2023,
Naik NC, Sahu NK, Patra TK
2023 International Conference on Communication, Circuits, and Systems (IC3S), BHUBANESWAR, India. IEEE: 1-5; ISBN 9798350325911
-
2022 2nd Asian Conference on Innovation in Technology (ASIANCON), Ravet, India. IEEE: 1-5; ISBN 978-1-6654-6852-7
-
2016,
Nate K, Tentzeris MM
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Honolulu, HI, USA. IEEE; ISBN 978-1-5090-6186-0
-
2006,
Nawarathna D, Claycomb JR, Cardenas G, Gardner J, Warmflash D, Miller Jr JH, Widger WR
Phys Rev E Stat Nonlin Soft Matter Phys 73 (5) Pt 1: 051914
-
2023,
Nazir N, Sheikh JA, Khan UR
2023 10th IEEE Uttar Pradesh Section International Conference on Electrical, Electronics and Computer Engineering (UPCON), Gautam Buddha Nagar, India. IEEE: 598-601; ISBN 9798350382488
-
2021,
Nehra RK, Raghava NS
2021 International Conference on Industrial Electronics Research and Applications (ICIERA), New Delhi, India. IEEE: 1-5; ISBN 978-1-6654-3543-7
-
2001,
Nemec P, Altmann J, Marhold S, Burda H, Oelschläger HHA
Science 294 (5541): 366-368
-
2006,
Neufang M, Heinze HJ, Duzel E
Clin EEG Neurosci 37 (4): 300-308