The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2022,
Yang B, Chen CH, Graham SJ
IEEE Letters on Electromagnetic Compatibility Practice and Applications 4 (3): 83-87
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2022,
Liu S, Onishi T, Taki M, Watanabe S
IEEE Trans Electromagn Compat 64 (4): 963-974
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2022,
Gifuni A, Adil M, Grassini G, Buono A, Nunziata F, Micheli D, Migliaccio M
IEEE Trans Electromagn Compat 64 (4): 951-962
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IEEE Trans Electromagn Compat 64 (4): 941-950
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2022,
Xiao C, Hao S, Cheng D, Liao C
IEEE Trans Biomed Circuits Syst 16 (3): 372-383
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2022,
Gryz K, Karpowicz J, Zradziński P
Sensors 22 (5): 1719
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2022,
Shah IA, Basir A, Cho Y, Yoo H
IEEE Trans Electromagn Compat 64 (3): 640-649
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2022,
Budnarowska M, Mizeraczyk J, Bisewski D
Prz Elektrotechniczny 98 (2): 110-113
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2022,
Liu J, Wang Y, Guo R, Wang Q, Zheng J, Kurpad K, Kainz W, Chen J
IEEE Trans Electromagn Compat 64 (2): 286-294
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2022,
Lan J, Diao Y, Duan X, Hirata A
IEEE Trans Electromagn Compat 64 (2): 551-558
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2022,
Sassi O, Kadi M, Niederholz M
IEEE Trans Electromagn Compat 64 (1): 139-149
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2022,
Narusue Y, Morikawa H
IEEE Trans Magn 58 (2): 1-5
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Institute of Electrical and Electronics Engineers (IEEE),
IEEE Std 149-2021: 1-207, ISBN 978-1-5044-8017-8
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2023,
Rhee J, Ahn J, Kim H, Lee C, Ahn S
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan. IEEE: 1-4; ISBN 9798350309973
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2023,
Gutiérrez-Martínez J, Toledo-Peral CL, Vega-Martínez G, Mercado-Gutiérrez JA
2023 Global Medical Engineering Physics Exchanges/Pacific Health Care Engineering (GMEPE/PAHCE), Songdo, Korea, Republic of. IEEE: 1-6; ISBN 9798350304015
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2023,
Vélez RS, van Helvoort MJAM, Vogt-Ardatjew R, Van den Berg B, Leferink F
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2023,
Zhou X, Dou L, Huang H, Shen Q, Zhou X, Li A, Tang W, Pang X, Zhang Y, Wu T
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-5; ISBN 9798350333114
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2023,
Xinhua P, Xin Z, Huixiong H, Qingfei S, Anxiang L, Wei T, Chao Y, Tong W
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-5; ISBN 9798350333114
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2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-4; ISBN 9798350333114
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2023,
Li C, Sha S, Zhao H, Xing L, Xu Q
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-3; ISBN 9798350333114
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Electronics 12 (23): 4780
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2023,
Xu Z, Rodriguez-Villegas E
IEEE Trans Biomed Circuits Syst [in press]
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2023,
Wu J, Ye J, Zou J, Gao J, Cui K
IEEE Access 11: 134191-134198
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2023,
Giurgiuman A, Gliga M, Bojita A, Andreica S, Munteanu C, Topa V, Constantinescu C, Pacurar C
Technologies 11 (6): 159
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IEEE Trans Electromagn Compat [in press]