The following terms were included:
"wireless power transfer", "kabellose Leistungsübertragung", "drahtlose Energieübertragung", "induktives Laden", WPT, "inductive charging", "wireless charging", "wireless power"
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2020,
Halašová E, Tóthová B, Kmeťová Sivoňová M, Okajčeková T, Škovierová H, Špánik P, Pavelek M, Frivaldský M
2020 ELEKTRO, Taormina, Italy. IEEE: 1-6; ISBN 978-1-7281-7543-0
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2021,
Halim MA, Rendon-Hernandez AA, Smith SE, Samman JM, Garraud N, Arnold DP
J Microelectromech Syst 30 (1): 144-155
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2020,
Halim MA, Smith SE, Samman JM, Arnold DP
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS), Vancouver, BC, Canada. IEEE: 590-593; ISBN 978-1-7281-3582-3
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2020,
Halim MA, Rendon-Hernandez AA, Arnold DP
2020 IEEE PELS Workshop on Emerging Technologies: Wireless Power Transfer (WoW), Seoul, Korea (South). IEEE: 271-274; ISBN 978-1-7281-3747-6
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2019,
Halim MA, Samman JM, Smith SE, Arnold DP
2019 19th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS), Krakow, Poland. IEEE: 1-5; ISBN 978-1-7281-5639-2
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2018,
Hamnerius Y, Nilsson T, Rylander T, Winges J, Ekman C, Petersson C, Fransson T
2018 2nd URSI Atlantic Radio Science Meeting (AT-RASC), Gran Canaria, Spain. IEEE: 1-4; ISBN 978-1-5386-3764-7
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2016,
Hariri A, El Hariri M, El Sayyed A, Mohammed OA
2016 IEEE Vehicle Power and Propulsion Conference (VPPC), Hangzhou, China. IEEE; ISBN 978-1-5090-3529-8
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2023,
Haussmann N, Stroka S, Schmuelling B, Clemens M
Compel - Int J Comp Math Electr Electron Eng 42 (5): 982-992
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2023,
Haussmann N, Mease R, Zang M, Stroka S, Hensel H, Clemens M
Compel - Int J Comp Math Electr Electron Eng 42 (4): 903-913
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2023,
Haussmann N, Zang M, Mease R, Schmuelling B, Clemens M
Int J Numer Model 36 (3): e3075
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2022,
Haussmann N, Zang M, Mease R, Clemens M, Schmuelling B, Bolten M
Compel - Int J Comp Math Electr Electron Eng 41 (3): 878-888
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2019,
Hayashi H, Sasatani T, Narusue Y, Kawahara Y
2019 IEEE 90th Vehicular Technology Conference (VTC2019-Fall), Honolulu, HI, USA. IEEE: 1-5; ISBN 978-1-7281-1221-3
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2022,
He F, Zhang J, Xiao Z, Wang C, Duan L
2022 International Applied Computational Electromagnetics Society Symposium (ACES-China), Xuzhou, China. IEEE: 1-3; ISBN 978-1-6654-5237-3
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2019,
He Y, Leung PSW, Chow Y, Diao Y
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 750-753; ISBN 978-1-7281-1639-6
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2016,
He Y, Diao Y, Sun W, Leung SW, Siu YM
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Shenzhen, China. IEEE: 639-641; ISBN 978-1-4673-9494-9
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2023,
Herpers C, Rouse CD
2023 IEEE Wireless Power Technology Conference and Expo (WPTCE), San Diego, CA, USA. IEEE: 1-5; ISBN 9798350337389
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2017,
Hikage T, Yamagishi M, Shindo K, Nojima T
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, Korea (South). IEEE; ISBN 978-1-5386-3913-9
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2016,
Hikage T, Nojima T, Fujimoto H
Phys Med Biol 61 (12): 4522-4536
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2021,
Hirata A, Diao Y, Onishi T, Sasaki K, Ahn S, Colombi D, De Santis V, Laakso I, Giaccone L, Joseph W, Rashed EA, Kainz W, Chen J
IEEE Trans Electromagn Compat 63 (5): 1619-1630
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2013,
Hirata A, Tsuchida S, Laaskso I
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 89-92; ISBN 978-1-4673-4980-2
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2013,
Hirata A, Ito F, Laakso I
Phys Med Biol 58 (17): N241-N249
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2014,
Hirobe T, Uejima H, Uno H, Tateno Y, Ikeda K
2014 Asia-Pacific Microwave Conference, Sendai, Japan. IEEE: 1110-1112; ISBN 978-4-902339-31-4
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2018,
Hirtl R, Bodewein L, Schmiedchen K, Dechent D, Stunder D, Gräfrath D, Winter L, Kraus T, Driessen S, Schmid G
Federal Office for Radiation Protection (BfS),
Ressortforschungsberichte zur kerntechnischen Sicherheit und zum Strahlenschutz, BfS-RESFOR-139/18: 1-198
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2014,
Ho JS, Yeh AJ, Neofytou E, Kim S, Tanabe Y, Patlolla B, Beygui RE, Poon AS
Proc Natl Acad Sci USA 111 (22): 7974-7979
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2020,
Hong S, Jeong S, Lee S, Sim B, Kim H, Kim J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 623-625; ISBN 978-1-7281-7431-0