The following terms were included:
"wireless power transfer", "kabellose Leistungsübertragung", "drahtlose Energieübertragung", "induktives Laden", WPT, "inductive charging", "wireless charging", "wireless power"
-
2020,
Halašová E, Tóthová B, Kmeťová Sivoňová M, Okajčeková T, Škovierová H, Špánik P, Pavelek M, Frivaldský M
2020 ELEKTRO, Taormina, Italy. IEEE: 1-6; ISBN 978-1-7281-7543-0
-
2021,
Halim MA, Rendon-Hernandez AA, Smith SE, Samman JM, Garraud N, Arnold DP
J Microelectromech Syst 30 (1): 144-155
-
2020,
Halim MA, Smith SE, Samman JM, Arnold DP
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS), Vancouver, BC, Canada. IEEE: 590-593; ISBN 978-1-7281-3582-3
-
2020,
Halim MA, Rendon-Hernandez AA, Arnold DP
2020 IEEE PELS Workshop on Emerging Technologies: Wireless Power Transfer (WoW), Seoul, Korea (South). IEEE: 271-274; ISBN 978-1-7281-3747-6
-
2019,
Halim MA, Samman JM, Smith SE, Arnold DP
2019 19th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS), Krakow, Poland. IEEE: 1-5; ISBN 978-1-7281-5639-2
-
2018,
Hamnerius Y, Nilsson T, Rylander T, Winges J, Ekman C, Petersson C, Fransson T
2018 2nd URSI Atlantic Radio Science Meeting (AT-RASC), Gran Canaria, Spain. IEEE: 1-4; ISBN 978-1-5386-3764-7
-
2016,
Hariri A, El Hariri M, El Sayyed A, Mohammed OA
2016 IEEE Vehicle Power and Propulsion Conference (VPPC), Hangzhou, China. IEEE; ISBN 978-1-5090-3529-8
-
2023,
Haussmann N, Stroka S, Schmuelling B, Clemens M
Compel - Int J Comp Math Electr Electron Eng 42 (5): 982-992
-
2023,
Haussmann N, Mease R, Zang M, Stroka S, Hensel H, Clemens M
Compel - Int J Comp Math Electr Electron Eng 42 (4): 903-913
-
2023,
Haussmann N, Zang M, Mease R, Schmuelling B, Clemens M
Int J Numer Model 36 (3): e3075
-
2022,
Haussmann N, Zang M, Mease R, Clemens M, Schmuelling B, Bolten M
Compel - Int J Comp Math Electr Electron Eng 41 (3): 878-888
-
2019,
Hayashi H, Sasatani T, Narusue Y, Kawahara Y
2019 IEEE 90th Vehicular Technology Conference (VTC2019-Fall), Honolulu, HI, USA. IEEE: 1-5; ISBN 978-1-7281-1221-3
-
2022,
He F, Zhang J, Xiao Z, Wang C, Duan L
2022 International Applied Computational Electromagnetics Society Symposium (ACES-China), Xuzhou, China. IEEE: 1-3; ISBN 978-1-6654-5237-3
-
2019,
He Y, Leung PSW, Chow Y, Diao Y
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 750-753; ISBN 978-1-7281-1639-6
-
2016,
He Y, Diao Y, Sun W, Leung SW, Siu YM
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Shenzhen, China. IEEE: 639-641; ISBN 978-1-4673-9494-9
-
2023,
Herpers C, Rouse CD
2023 IEEE Wireless Power Technology Conference and Expo (WPTCE), San Diego, CA, USA. IEEE: 1-5; ISBN 9798350337389
-
2017,
Hikage T, Yamagishi M, Shindo K, Nojima T
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, Korea (South). IEEE; ISBN 978-1-5386-3913-9
-
2016,
Hikage T, Nojima T, Fujimoto H
Phys Med Biol 61 (12): 4522-4536
-
2021,
Hirata A, Diao Y, Onishi T, Sasaki K, Ahn S, Colombi D, De Santis V, Laakso I, Giaccone L, Joseph W, Rashed EA, Kainz W, Chen J
IEEE Trans Electromagn Compat 63 (5): 1619-1630
-
2013,
Hirata A, Tsuchida S, Laaskso I
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 89-92; ISBN 978-1-4673-4980-2
-
2013,
Hirata A, Ito F, Laakso I
Phys Med Biol 58 (17): N241-N249
-
2014,
Hirobe T, Uejima H, Uno H, Tateno Y, Ikeda K
2014 Asia-Pacific Microwave Conference, Sendai, Japan. IEEE: 1110-1112; ISBN 978-4-902339-31-4
-
2018,
Hirtl R, Bodewein L, Schmiedchen K, Dechent D, Stunder D, Gräfrath D, Winter L, Kraus T, Driessen S, Schmid G
Federal Office for Radiation Protection (BfS),
Ressortforschungsberichte zur kerntechnischen Sicherheit und zum Strahlenschutz, BfS-RESFOR-139/18: 1-198
-
2014,
Ho JS, Yeh AJ, Neofytou E, Kim S, Tanabe Y, Patlolla B, Beygui RE, Poon AS
Proc Natl Acad Sci USA 111 (22): 7974-7979
-
2020,
Hong S, Jeong S, Lee S, Sim B, Kim H, Kim J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 623-625; ISBN 978-1-7281-7431-0
-
2018 International Symposium on Antennas and Propagation (ISAP), Busan, Korea (South). IEEE: 1-2; ISBN 978-1-5386-5389-0
-
2014,
Hong SE, Cho IK, Choi HD, Pack JK
2014 IEEE Wireless Power Transfer Conference, Jeju, Korea (South). IEEE: 14395318; ISBN 978-1-4799-2923-8
-
2015,
Hongseok K, Song C, Joungho K
2015 IEEE Wireless Power Transfer Conference (WPTC), Boulder, CO, USA. IEEE: 1-3; ISBN 978-1-4673-7447-7
-
2024,
Honjo Y, Caremel C, Kawahara Y, Sasatani T
IEEE Antennas Wirel Propag Lett 23 (1): 94-98
-
2024,
Hosur S, Kashani Z, Karan SK, Priya S, Kiani M
IEEE Trans Biomed Circuits Syst 18 (2): 383-395
-
2023,
Hosur S, Karan SK, Priya S, Kiani M
2023 IEEE Biomedical Circuits and Systems Conference (BioCAS), Toronto, ON, Canada. IEEE: 1-5; ISBN 9798350300277
-
2011,
Hou KC, Chang CW, Chiou JC, Huang YH, Shaw FZ
IET Nanobiotechnol 5 (4): 143-147
-
2020,
Hou S, Yu B, Yan W, Zhu C, Wang K, Wu Z
2020 IEEE International Conference on Information Technology,Big Data and Artificial Intelligence (ICIBA), Chongqing, China. IEEE: 798-802; ISBN 978-1-7281-5225-7
-
2018,
Houran MA, Yang X, Chen W, Samizadeh M
2018 International Power Electronics Conference (IPEC-Niigata 2018 -ECCE Asia), Niigata, Japan. IEEE: 1062-1066; ISBN 978-1-5386-4190-3
-
2021,
Hu S, Bao J, Hu G, Ta D, Liu R, Zheng L
IEEE Trans Antennas Propag 69 (6): 3485-3492
-
2009,
Huang CY, Boys JT, Covic GA, Budhia M
2009 IEEE Vehicle Power and Propulsion Conference, Dearborn, MI, USA. IEEE: 402-407; ISBN 978-1-4244-2600-3
-
2019,
Huang X, Lu C, Tao X, Rong C, Liu M
2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring), Rome, Italy. IEEE: 4256-4262; ISBN 978-1-7281-3404-8
-
2022,
Huang Y, Li H, Hu T, Li J, Yiu CK, Zhou J, Li J, Huang X, Yao K, Qiu X, Zhou Y, Li D, Zhang B, Shi R, Liu Y, Wong TH, Wu M, Jia H, Gao Z, Zhang Z, He J, Zheng M, Song E, Wang L, Xu C, Yu X
Nano Lett 22 (14): 5944-5953
-
2023,
Hueros V, Barrado A, Lázaro A, Fernández C
2023 IEEE 17th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG), Tallinn, Estonia. IEEE: 1-6; ISBN 9798350300055
-
IEEE Electromagn Compat Mag 7 (1): 78-86
-
2018,
Ibrahim A, Meng M, Kiani M
IEEE Sens J 18 (9): 3813-3826
-
IEEE Trans Biomed Circuits Syst 10 (6): 1100-1111
-
2019,
Ibrahim AU, Zhong W, Cui H, Li H, Xu D
2019 IEEE Energy Conversion Congress and Exposition (ECCE), Baltimore, MD, USA. IEEE: 4575-4579; ISBN 978-1-7281-0396-9
-
2018,
Ibrahim AU, Zhong W, Cui H, Xu D
2018 IEEE International Power Electronics and Application Conference and Exposition (PEAC), Shenzhen, China. IEEE: 1-6; ISBN 978-1-5386-6055-3
-
2015,
Ibrahim M, Pichon L, Bernard L, Razek A, Houivet J, Cayol O
IEEE Transactions on Vehicular Technology 64 (2): 421-430
-
2023,
Ikeda A, Fujimoto M
2023 Asia-Pacific Microwave Conference (APMC), Taipei, Taiwan. IEEE: 186-188; ISBN 978-1-6654-9419-9
-
Microw and Opt Tech Letters 65 (12): 3204-3210
-
2021,
Iqbal A, Al-Hasan M, Ben Mabrouk I, Basir A, Nedil M, Yoo H
IEEE Trans Microw Theory Tech 69 (7): 3438-3451
-
2015,
Ishihara S, Onishi T, Hirata A
IEICE Trans Comm E98B (12): 2470-2476
-
2020,
Ishii N, Chakarothai J, Wake K, Watanabe S
IEEE Trans Instrum Meas 69 (6): 3078-3088