2021 IEEE International Conference on the Properties and Applications of Dielectric Materials (ICPADM), Johor Bahru, Malaysia. IEEE: pp. 386-389; ISBN 978-1-7281-8239-1
2021 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Hvar, Croatia. IEEE: pp. 1-6; ISBN 978-1-6654-2456-1
2021,
Antwi OA, Owusu AO, Nanjo JW, Gidisu GB, Sackey D, Mohammed H