The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2014,
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 190-193; ISBN 978-4-88552-287-1
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2008,
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International Symposium on Electromagnetic Compatibility - EMC Europe, Hamburg, 2008. IEEE; ISBN 978-1-4244-4097-9
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IEEE Trans Electromagn Compat 63 (1): 286-293
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2022,
Narusue Y, Morikawa H
IEEE Trans Magn 58 (2): 1-5
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IEEE Trans Electromagn Compat 50 (2): 316-324
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2023,
Nazemi M, Dommerque R, Daniel S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2019,
Nefzi A, Lemercier CE, El Khoueiry C, Lewis N, Lagroye I, Boucsein C, Leveque P, Arnaud-Cormos D
2019 IEEE MTT-S International Microwave Biomedical Conference (IMBioC), Nanjing, China. IEEE: 1-3; ISBN 978-1-5386-7396-6
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2005,
Netzer MZ, Shechter A, Karni Z
Environmentalist 25 (2-4): 195-199
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2014,
Neufeld E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 230-233; ISBN 978-4-88552-287-1
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2012,
Nicolopoulou EP, Gonos IF, Stathopulos IA, Karabetsos E
IEEE Electromagn Compat Mag 1 (2): 50-59
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2017,
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2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA. IEEE; ISBN 978-1-5386-2232-2
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IEEE Electromagn Compat Mag 11 (3): 20-21
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IEEE Electromagn Compat Mag 9 (2): 27-29
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2021,
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IEEE Trans Electromagn Compat 63 (5): 1649-1657
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2019,
Omi S, Uno T, Arima T, Wiart J
IEEE Trans Electromagn Compat 61 (1): 48 - 56
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2020,
Onishi T, Niskala K, Christ A, Roman J
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-4; ISBN 978-1-7281-5580-7
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2006,
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2023,
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IEEE Trans Electromagn Compat 65 (1): 39-50
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1971 IEEE International Electromagnetic Compatibility Symposium Record, Philadelphia, PA, USA. IEEE: 155-161; ISBN 978-1-5090-3157-3
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2005,
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2005,
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2018,
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2017 IEEE 3rd Global Electromagnetic Compatibility Conference (GEMCCON), Sao Paulo, Brazil. IEEE: 1-5; ISBN 978-1-5386-2992-5
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2011,
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1996,
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2017,
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IEEE Trans Electromagn Compat 59 (5): 1390-1399