Die folgenden Begriffe wurden einbezogen:
"Long Term Evolution", "evolved UMTS Terrestrial Radio Access Network", "High Speed OFDM Packet Access", E-UTRAN, HSOPA, LTE, ロング・ターム・エボリューション, 高速OFDMパケットアクセス
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2024,
Delidimitriou S, Babas D, Samaras T
2024 Panhellenic Conference on Electronics & Telecommunications (PACET), Thessaloniki, Greece. IEEE: 1-4; ISBN 9798350318852
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023 IEEE 13th International Conference on Consumer Electronics - Berlin (ICCE-Berlin), Berlin, Germany. IEEE: 216-219; ISBN 9798350324167
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2023,
Zhou X, Dou L, Huang H, Shen Q, Zhou X, Li A, Tang W, Pang X, Zhang Y, Wu T
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-5; ISBN 9798350333114
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2023,
Shrivastava P, Sharma V
2023 4th International Conference on Intelligent Engineering and Management (ICIEM), London, United Kingdom. IEEE: 1-6; ISBN 9798350341133
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2023,
Karpowicz J, Gryz K, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-5; ISBN 9798350324013
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2023,
Gryz K, Karpowicz J, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-5; ISBN 9798350324013
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2023,
Ramos V, Suárez SD, Marina P, Febles VM, Rabassa LE, Hernández JA
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2023,
Douglas M, Jain N, Kochali B, Kuster N
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan. IEEE: 1-3; ISBN 9798350309973
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2023,
Asadi R, Aliakbarian H, Sahraei A, Yazdani R, Kim DH
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 608-613; ISBN 9798350309775
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2023,
Kopacz T, Schiffarth AM, Wuschek M, Bornkessel C
Landesamt für Natur, Umwelt und Verbraucherschutz Nordrhein-Westfalen (LANUV),
LANUV-Fachbericht 143: 1-138