Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2021 17th Conference on Electrical Machines, Drives and Power Systems (ELMA), Sofia, Bulgaria. IEEE: 1-4; ISBN 978-1-6654-1186-8
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2021,
Andreica S, Munteanu C, Gliga M, Pacurar C, Giurgiuman A, Constantinescu C, Morari C
2021 9th International Conference on Modern Power Systems (MPS), Cluj-Napoca, Romania. IEEE: 1-4; ISBN 978-1-6654-3383-9
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2021,
Yang W, Chen Q, Xu H, Li Y, Liang W, Dawalibi FP
2021 4th International Conference on Energy, Electrical and Power Engineering (CEEPE), Chongqing, China. IEEE: 599-604; ISBN 978-1-6654-3364-8
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2021,
Seidman SJ, Bassen HI
Biomed Instrum Technol 55 (3): 91-95
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2021,
Xu B, Colombi D, Törnevik C, Ghasemifard F, Chen J
IEEE Trans Electromagn Compat 63 (5): 1680-1689
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2021,
Kaschel H, Ahumada C, Osorio-Comparan R
2021 IEEE International Conference on Automation/XXIV Congress of the Chilean Association of Automatic Control (ICA-ACCA), Valparaíso, Chile. IEEE: 1-6; ISBN 978-1-6654-2978-8
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2021,
Mohd Baharin RH, Omi S, Uno T, Arima T
IEEE Trans Electromagn Compat 63 (5): 1658-1666
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2021,
Matsuzawa S-i, Kojima T, Mizuno K, Kagawa K, Wakamatsu A
IEEE Trans Electromagn Compat 63 (6): 1896-1903
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2021,
Campi T, Cruciani S, Maradei F, Feliziani M
IEEE Trans Electromagn Compat 63 (5): 1726-1734
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2021,
Shiina T, Kudo T, Herai D, Kuranari Y, Sekiba Y, Yamazaki K
IEEE Trans Electromagn Compat 63 (6): 1812-1819
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IEEE Trans Electromagn Compat 63 (5): 1690-1698
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2021,
Lottner T, Reiss S, Bitzer A, Bock M, Özen AC
IEEE Trans Electromagn Compat 63 (3): 662-672
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2021,
Wang Y, Zheng J, Wang Q, Chen J, Kainz W
IEEE Trans Electromagn Compat 63 (3): 673-680
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2021,
Shah IA, Cho Y, Yoo H
IEEE Trans Electromagn Compat 63 (3): 681-691
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2021,
Gifuni A, Grassini G, Buono A, Festa D, Flintoft ID, Gargiulo S, Nunziata F, Migliaccio M
IEEE Trans Electromagn Compat 63 (2): 427-434
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2021,
Hakuta Y, Watanabe T, Takenaka T, Ito T, Hirata A
IEEE Trans Electromagn Compat 63 (1): 313-318
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2022,
Li E, Li XJ, Seet BC
2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), Chengdu, China. IEEE: 101-104; ISBN 978-1-6654-2776-0
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2022,
Yang X, Guo R, Zheng J, Chen J
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: 606-609; ISBN 978-1-6654-0930-8
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2022,
Li Y, Liu D, Zhang J, Wu L
2022 International Conference on Mechanical and Electronics Engineering (ICMEE), Xi'an, China. IEEE: 162-166; ISBN 978-1-6654-9221-8
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2022,
Bräunlich R, Dalmus C, Dongus S, Eberhard J, Friedrich G, Fröhlich J, Röösli M, Schürmann D
Bundesamt für Energie (BFE),
Statusbericht 2022: 1-204
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2022,
Krupski P, Michalowska J
Prz Elektrotechniczny 98 (12): 217-220
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2022,
David A, Tiemann M, Schmuelling B, Haussmann N, Stroka S, Clemens M
2022 Second International Conference on Sustainable Mobility Applications, Renewables and Technology (SMART), Cassino, Italy. IEEE: 1-6; ISBN 978-1-6654-7147-3
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IEEE Electromagn Compat Mag 11 (3): 20-21
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2022,
Beard BB, Iacono MI, Guag JW, Liu Y
IEEE Electromagn Compat Mag 11 (3): 49-54
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2022,
Svistunou A, Mordachev V, Sinkevich E, Ye M, Dubovik A, Shakinka I
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 537-542; ISBN 978-1-6654-0789-2
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2022,
Pavel I, David V, Roman MG, Bordas AM
2022 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: 484-488; ISBN 978-1-6654-8995-9
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2022,
Xia M, Guo R, Zheng J, Chen J
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: 610-613; ISBN 978-1-6654-0930-8
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2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), Chengdu, China. IEEE: 319-322; ISBN 978-1-6654-2776-0
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2022,
Diao Y, Rashed EA, Hirata A
IEEE Trans Electromagn Compat 64 (6): 1969-1977
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2022,
Colombi D, Ghasemifard F, Joshi P, Xu B, Di Paola C, Törnevik C
IEEE Trans Electromagn Compat 64 (6): 1986-1993
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2022,
ElShami IF, Elwrfalli K, Elgayar AI, Elgaud MM, Yousuf FH, Elmangosh N
2022 International Conference on Engineering & MIS (ICEMIS), Istanbul, Turkey. IEEE: 1-5; ISBN 978-1-6654-5437-7
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2022,
Li S, Jiang Y, Tang C, Luo Z, Liu L, Li Z, Gu C
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: 563-565; ISBN 978-1-6654-1672-6
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2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 525-530; ISBN 978-1-6654-0789-2
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2022,
Silla G, Bastianelli L, Colella E, Moglie F, Primiani VM
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 151-156; ISBN 978-1-6654-0789-2
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2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 145-150; ISBN 978-1-6654-0789-2
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2022,
Hammen L, Pichon L, Le Bihan Y, Bensetti M, Fleury G
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 114-119; ISBN 978-1-6654-0789-2
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2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 311-316; ISBN 978-1-6654-0789-2
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2022,
Esmaeili H, Yang C, Schuster C
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 467-472; ISBN 978-1-6654-0789-2
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2022,
Marina P, Suárez SD, Hernández JA, Febles VM, Rabassa LE, Ramos V
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 519-524; ISBN 978-1-6654-0789-2
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2022,
Johansson M, Carlsson J
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 137-140; ISBN 978-1-6654-0789-2
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2022,
Zhou C, Synder DP, Epstein B, Robinson ZT, Jin GY, Tang PY, Polcawich RG, Roper M
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: 439-442; ISBN 978-1-6654-0930-8
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2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: 306-308; ISBN 978-1-6654-1672-6
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2022,
Guo R, Xia M, Zheng J, Chen J, Shrivastava D
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: 210-212; ISBN 978-1-6654-1672-6
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2022,
Li J, Changyuan W, Yujie Z
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: 261-263; ISBN 978-1-6654-1672-6
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2022,
Duris V, Ivanov VN, Chumarov SG
TEM J 11 (2): 920-925
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2022,
Grazian F, Shi W, Soeiro TB, Dong J, Bauer P
2022 Wireless Power Week (WPW), Bordeaux, France. IEEE: 54-59; ISBN 978-1-6654-8446-6
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2022,
Zimmer S, Helwig M, Winkler A, Modler N
Electronics 11 (14): 2156
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2022,
Kapetanović AL, Poljak D
IEEE Trans Electromagn Compat 64 (5): 1296-1303
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Energies 15 (12): 4455
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2022,
Bertoluzzo M, Di Barba P, Forzan M, Mognaschi ME, Sieni E
Eng Comput 39 (7): 2802-2819