Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2020,
Song X, Yue Y, Zhu X, Chang H
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-4; ISBN 978-1-7281-5580-7
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2019,
Songcen W, Bin W, Xiaokang W, Chong X, Jinxing X, Weimei G, Jiaqi X
2019 22nd International Conference on Electrical Machines and Systems (ICEMS), Harbin, China. IEEE: 1-7; ISBN 978-1-7281-3399-7
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2006,
Sorri MJ, Piiparinen PJ, Huttunen KH, Haho MJ
IEEE Trans Neural Syst Rehabil Eng 14 (1): 101-108
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2023,
Souček T, Richter A, Morava J, Slavík L
2023 5th International Congress on Human-Computer Interaction, Optimization and Robotic Applications (HORA), Istanbul, Turkiye. IEEE: 1-4; ISBN 9798350337532
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2012,
Spathmann O, Hansen V, Streckert J, Zhou Y, Clemens M, Grote K, Klose M, Lerchl A
International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, 2012. IEEE: 13225800; ISBN 978-1-4673-0717-8
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2024,
Sufian MA, Hussain N
IEEE Trans Electromagn Compat [im Druck]
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2018,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong YC
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 872-874; ISBN 978-1-5090-3955-5
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2017,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong RYC, Lo WK
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
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2017,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong R
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, Korea (South). IEEE; ISBN 978-1-5386-3913-9
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2014,
Sunohara T, Laakso I, Hirata A, Onishi T
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 449-452; ISBN 978-4-88552-287-1