Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2010 Asia-Pacific International Symposium on Electromagnetic Compatibility, Beijing, China. IEEE: 9-12; ISBN 978-1-4244-5622-2
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Deutsche Kommission Elektrotechnik Elektronik Informationstechnik in DIN und VDE (DKE),
DIN EN 60601-1-2 VDE 0750-1-2 Berichtigung 1:2010-05
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2010,
Gati A, Conil E, Wong MF, Wiart J
IEEE Trans Electromagn Compat 52 (4): 829 - 836
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2010,
Hadjem A, Conil E, Gati A, Wong MF, Wiart J
IEEE Trans Electromagn Compat 52 (4): 812-819
-
IEEE Trans Electromagn Compat 52 (4): 820-828
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2010,
Hirata A, Fujiwara O, Nagaoka T, Watanabe S
IEEE Trans Electromagn Compat 52 (1): 41-48
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2010,
Ju M, Yang K, Myung S
IEEE Trans Electromagn Compat 52 (4): 843-848
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2009,
Trinchero D, Stefanelli R, Longobardi F, Galardini A, Fiorelli B, d'Amore G, Anglesio L, Benedetto A, Trinchero S, Borsero M, Vizio G
IEEE Antennas Wirel Propag Lett 8: 224-227
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2009,
Bottauscio O, Chiampi M, Pastorelli M, Pons E, Zilberti L
2009 13th European Conference on Power Electronics and Applications, Barcelona, Spain. IEEE: 1-10; ISBN 978-1-4244-4432-8
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2009,
Becerra M, Cooray V
IEEE Trans Electromagn Compat 51 (4): 1001-1008
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2009,
Hille S, Eichhorn KF, Gonschorek KH
2009 IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, USA. IEEE: 147-152; ISBN 978-1-4244-4266-9
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2009,
Davis CC, Balzano Q
IEEE Trans Electromagn Compat 51 (2): 210-216
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2009,
Gosselin MC, Christ A, Kühn S, Kuster N
IEEE Trans Electromagn Compat 51 (2): 227-235
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2008,
Pisa S, Calcagnini G, Cavagnaro M, Piuzzi E, Mattei E, Bernardi P
IEEE Trans Electromagn Compat 50 (1): 35-42
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IEEE Trans Electromagn Compat 50 (2): 316-324
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2008,
Thors B, Strydom ML, Hansson B, Meyer FJC, Kärkkäinen K, Zollman P, Ilvonen S, Törnevik C
IEEE Trans Electromagn Compat 50 (4): 837 - 848
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2008,
Joseph W, Verloock L, Martens L
IEEE Trans Electromagn Compat 50 (3): 730-735
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Nihon Hoshasen Gijutsu Gakkai Zasshi 64 (7): 897-901
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2008,
Keine Autoren angegeben
BGBl I (6): 220-232
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Biomed Eng Online 7: 7
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2007,
Ren DQ, Yang WQ, Zhao T, Li XJ, Zeng GY, Zhang J, Li YR
2007 International Symposium on Electromagnetic Compatibility, Qingdao, China. IEEE: 479-481; ISBN 978-1-4244-1372-0
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2007,
Hirata A, Nagaya Y, Fujiwara O, Nagaoka T, Watanabe S
2007 IEEE International Symposium on Electromagnetic Compatibility, Honolulu, HI, USA. IEEE: 1-4; ISBN 978-1-4244-1349-2
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2007,
Kuhn S, Lott U, Kramer A, Kuster N
IEEE Trans Electromagn Compat 49 (3): 519-525
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2007,
Tarusawa Y, Nishiki S, Nojima T
IEEE Transactions on Vehicular Technology 56 (3): 1295-1306
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Deutsche Kommission Elektrotechnik Elektronik Informationstechnik in DIN und VDE (DKE),
DIN EN 60601-1-2 VDE 0750-1-2:2007-12
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2007,
Gonzalez MC, Peratta A, Poljak D
IEEE Trans Electromagn Compat 49 (1): 153-162
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2007,
Ilvonen S, Sarvas J
IEEE Trans Electromagn Compat 49 (2): 294-301
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2007,
Mochizuki S, Wakayanagi H, Hamada T, Watanabe S, Taki M, Yamanaka Y, Shirai H
IEEE Trans Electromagn Compat 49 (3): 512-518
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2007,
Samaras T, Kalampaliki E, Sahalos JN
IEEE Trans Electromagn Compat 49 (4): 936-939
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2007,
Lee AK, Choi HD, Choi JI
IEEE Trans Electromagn Compat 49 (2): 302-312
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2007,
Buccella C, De Santis V, Feliziani M
IEEE Trans Electromagn Compat 49 (4): 825-833
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2007,
Bit-Babik G, Morrissey JJ, Faraone A, Balzano Q
Ann Ist Super Sanita 43 (3): 218-224
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2006,
Hirata A, Fujimoto M, Asano T, Jianqing Wang, Fujiwara O, Shiozawa T
IEEE Trans Electromagn Compat 48 (3): 569-578
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2006,
Fujimoto M, Hirata A, Wang J, Fujiwara O, Shiozawa T
IEEE Trans Electromagn Compat 48 (1): 240-247
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2006,
Davis CC, Beard BB, Tillman A, Rzasa J, Merideth E, Balzano Q
IEEE Trans Electromagn Compat 48 (3): 579-588
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2006,
Araneo R, Celozzi S
IEEE Trans Electromagn Compat 48 (4): 792 - 804
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2006,
Wang J, Fujiwara O, Watanabe S
IEEE Trans Electromagn Compat 48 (2): 408-413
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2006,
Augello A, Della Chiara G, Primiani V, Moglie F
IEEE Trans Electromagn Compat 48 (3): 502-515
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2006,
Robinson MP, Clegg J, Marvin AC
IEEE Trans Electromagn Compat 48 (2): 304-310
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2006,
Beard BB, Kainz W, Onishi T, Iyama T, Watanabe S, Fujiwara O, Wang J, Bit-Babik G, Faraone A, Wiart J, Christ A, Kuster N, Lee AK, Kroeze H, Siegbahn M, Keshvari J, Abrishamkar H, Simon W, Manteuffel D, Nikoloski N
IEEE Trans Electromagn Compat 48 (2): 397-407
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2006,
Wang J, Fujita M, Fujiwara O, Wake K, Watanabe S
IEEE Trans Electromagn Compat 48 (3): 545-551
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2006,
Fernandez-Chimeno M, Quilez M, Silva F
IEEE Trans Biomed Eng 53 (6): 1206-1209
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Telemed J E Health 12 (3): 373-382
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IEEE 6th International Symposium on Electromagnetic Compatibility and Electromagnetic Ecology, 2005, St. Petersburg, Russia. IEEE: 9-14; ISBN 978-0-7803-9374-5
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2005,
Giliberti C, Bedini A, Palomba R, D'Emilia E, Magli CV, Giuliani L
IEEE 6th International Symposium on Electromagnetic Compatibility and Electromagnetic Ecology, 2005, St. Petersburg, Russia. IEEE: 208-212; ISBN 978-0-7803-9374-5
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2005,
Tarusawa Y, Ohshita K, Suzuki Y, Nojima T, Toyoshima T
IEEE Trans Electromagn Compat 47 (4): 938-950
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2005,
Jianqing W, Fujiwara O, Uda T
IEEE Trans Electromagn Compat 47 (4): 971-976
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2005,
Joseph W, Martens L
IEEE Trans Electromagn Compat 47 (4): 977-985
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2005,
Abd-Alhameed RA, Excell PS, Mangoud MA
IEEE Trans Electromagn Compat 47 (2): 374-381
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2005,
Razansky D, Soldea DF, Einziger PD
IEEE Trans Electromagn Compat 47 (1): 61-67