Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2011,
Conil E, Hadjem A, Gati A, Wong MF, Wiart J
IEEE Trans Electromagn Compat 53 (1): 48-52
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2011,
De Santis V, Beeckman PA, Lampasi DA, Feliziani M
IEEE Trans Biomed Eng 58 (2): 390-396
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2010 Asia-Pacific International Symposium on Electromagnetic Compatibility, Beijing, China. IEEE: 9-12; ISBN 978-1-4244-5622-2
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Deutsche Kommission Elektrotechnik Elektronik Informationstechnik in DIN und VDE (DKE),
DIN EN 60601-1-2 VDE 0750-1-2 Berichtigung 1:2010-05
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2010,
Gati A, Conil E, Wong MF, Wiart J
IEEE Trans Electromagn Compat 52 (4): 829 - 836
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2010,
Hadjem A, Conil E, Gati A, Wong MF, Wiart J
IEEE Trans Electromagn Compat 52 (4): 812-819
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IEEE Trans Electromagn Compat 52 (4): 820-828
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2010,
Hirata A, Fujiwara O, Nagaoka T, Watanabe S
IEEE Trans Electromagn Compat 52 (1): 41-48
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2010,
Ju M, Yang K, Myung S
IEEE Trans Electromagn Compat 52 (4): 843-848
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2009,
Trinchero D, Stefanelli R, Longobardi F, Galardini A, Fiorelli B, d'Amore G, Anglesio L, Benedetto A, Trinchero S, Borsero M, Vizio G
IEEE Antennas Wirel Propag Lett 8: 224-227
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2009,
Bottauscio O, Chiampi M, Pastorelli M, Pons E, Zilberti L
2009 13th European Conference on Power Electronics and Applications, Barcelona, Spain. IEEE: 1-10; ISBN 978-1-4244-4432-8
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2009,
Becerra M, Cooray V
IEEE Trans Electromagn Compat 51 (4): 1001-1008
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2009,
Hille S, Eichhorn KF, Gonschorek KH
2009 IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, USA. IEEE: 147-152; ISBN 978-1-4244-4266-9
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2009,
Davis CC, Balzano Q
IEEE Trans Electromagn Compat 51 (2): 210-216
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2009,
Gosselin MC, Christ A, Kühn S, Kuster N
IEEE Trans Electromagn Compat 51 (2): 227-235
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2008,
Pisa S, Calcagnini G, Cavagnaro M, Piuzzi E, Mattei E, Bernardi P
IEEE Trans Electromagn Compat 50 (1): 35-42
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IEEE Trans Electromagn Compat 50 (2): 316-324
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2008,
Thors B, Strydom ML, Hansson B, Meyer FJC, Kärkkäinen K, Zollman P, Ilvonen S, Törnevik C
IEEE Trans Electromagn Compat 50 (4): 837 - 848
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2008,
Joseph W, Verloock L, Martens L
IEEE Trans Electromagn Compat 50 (3): 730-735
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Nihon Hoshasen Gijutsu Gakkai Zasshi 64 (7): 897-901
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2008,
Keine Autoren angegeben
BGBl I (6): 220-232
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Biomed Eng Online 7: 7
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2007,
Ren DQ, Yang WQ, Zhao T, Li XJ, Zeng GY, Zhang J, Li YR
2007 International Symposium on Electromagnetic Compatibility, Qingdao, China. IEEE: 479-481; ISBN 978-1-4244-1372-0
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2007,
Hirata A, Nagaya Y, Fujiwara O, Nagaoka T, Watanabe S
2007 IEEE International Symposium on Electromagnetic Compatibility, Honolulu, HI, USA. IEEE: 1-4; ISBN 978-1-4244-1349-2
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2007,
Kuhn S, Lott U, Kramer A, Kuster N
IEEE Trans Electromagn Compat 49 (3): 519-525