Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2001,
Kainz W, Neubauer G, Alesch F, Schmid G, Jahn O
Wien Klin Wochenschr 113 (23-24): 903-914
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2000,
Caputa K, Stuchly MA, Skopec M, Bassen HI, Ruggera P, Kanda M
IEEE Trans Microw Theory Tech 48 (11): 2148-2154
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1999,
Davis D, Segal B, Pavlasek T
Biomed Instrum Technol 33 (5): 411-416
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1996,
Paperman D, David Y, Martinez M
J Clin Eng 21 (3): 207-211
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1994,
Ruppe I, Eggert S, Goltz S, Hentschel K
Bundesanstalt für Arbeitsschutz und Arbeitsmedizin (BAuA),
Ergebnisbericht, 11.002: 1-84
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1994,
Clifford KJ, Joyner KH, Stroud DB, Wood M, Ward B, Fernandez CH
Australas Phys Eng Sci Med 17 (1): 23-27
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Med Device Technol 3 (4): 42-49
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2023,
Rhee J, Ahn J, Kim H, Lee C, Ahn S
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan. IEEE: 1-4; ISBN 9798350309973
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2023,
Li C, Sha S, Zhao H, Xing L, Xu Q
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-3; ISBN 9798350333114
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Electronics 12 (23): 4780
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2023,
Xu Z, Rodriguez-Villegas E
IEEE Trans Biomed Circuits Syst [im Druck]
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2023,
Bastian GG, Pinto Nunes T, Quílez M, Fernández-Chimeno M, Silva F
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2023,
Campi T, Cecilia V, Mattei E, Boumerdassi W, Rotellini M, Tatangelo G, Feliziani M
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan. IEEE: 1-4; ISBN 9798350309973
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2023,
Parsa N, Sanphuang V
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 655; ISBN 9798350309775
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2023,
Boukabou I, Rupanetti D, Kaabouch N, Foust L
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 413-418; ISBN 9798350309775
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2023,
Asadi R, Aliakbarian H, Sahraei A, Yazdani R, Kim DH
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 608-613; ISBN 9798350309775
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2022,
Li E, Li XJ, Seet BC
2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), Chengdu, China. IEEE: 101-104; ISBN 978-1-6654-2776-0
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2022,
Bräunlich R, Dalmus C, Dongus S, Eberhard J, Friedrich G, Fröhlich J, Röösli M, Schürmann D
Bundesamt für Energie (BFE),
Statusbericht 2022: 1-204
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2022,
Krupski P, Michalowska J
Prz Elektrotechniczny 98 (12): 217-220
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2022,
Svistunou A, Mordachev V, Sinkevich E, Ye M, Dubovik A, Shakinka I
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 537-542; ISBN 978-1-6654-0789-2
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2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), Chengdu, China. IEEE: 319-322; ISBN 978-1-6654-2776-0
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2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 525-530; ISBN 978-1-6654-0789-2
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2022,
Silla G, Bastianelli L, Colella E, Moglie F, Primiani VM
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 151-156; ISBN 978-1-6654-0789-2
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2022,
Hammen L, Pichon L, Le Bihan Y, Bensetti M, Fleury G
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 114-119; ISBN 978-1-6654-0789-2
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2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 311-316; ISBN 978-1-6654-0789-2