Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2024,
Jiang S, Wang H, Li D, Wang J, Pun SH, Vai MI, Gao Y
2024 Cross Strait Radio Science and Wireless Technology Conference (CSRSWTC), Macao, China. IEEE: S. 1-3; ISBN 9798331507800
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2024,
Ren M, Yin F, Fang Y, Chen J, Qin Z
2024 4th International Conference on Energy Engineering and Power Systems (EEPS), Hangzhou, China. IEEE: S. 815-820; ISBN 9798350366921
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2024,
Saride JMR, Saranya S, Thommandru R, Saravanakumar R, Narayan P, Sathish M
2024 8th International Conference on Electronics, Communication and Aerospace Technology (ICECA), Coimbatore, India. IEEE: S. 171-177; ISBN 9798350367911
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2024,
Nyakuri JP, Gatera O, Hwata C, Rushingabigwi G, Twizere C, Mukanyiligira D
2024 6th International Conference on Communications, Signal Processing, and their Applications (ICCSPA), Istanbul, Turkiye. IEEE: S. 1-6; ISBN 9798350384826
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2024,
Vivarelli C, Mattei E, Censi F, Calcagnini G, Freschi F, Giaccone L, Canova A
2024 46th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Orlando, FL, USA. IEEE: S. 1-4; ISBN 9798350371505
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2024,
Zhou WY, Xu JJ, Lu M, Li YX
Phys Scr 99 (12): 125513
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2024,
Litzbarski LS, Olesz M, Redlarski G, Tojza PM, Zak A, Gifuni E, Cieslikowska Z, Czaplinski M
Appl Sci 14 (21): 9668
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2024,
Roman MG, Adochiei IR, Adochiei FC
Costin HN, Magjarević R, Petroiu GG (Hrsg.): Advances in Digital Health and Medical Bioengineering, Vol 1, EHB-2023, Bucharest. IFMBE Proceedings, Band 109; Springer, Cham; S. 367-374; ISBN 978-3-031-62501-5
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2024,
Ketelhut S, Zutz H, Hupe O
J Radiol Prot 44 (4): 041510
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2024,
Umadevi V, Ranganathan S
2024 15th International Conference on Computing Communication and Networking Technologies (ICCCNT), Kamand, India. IEEE: S. 1-6; ISBN 9798350370270
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2024,
Yamaguchi-Sekino S, Ikuyo M, Tobita K, Onishi T, Taki M, Watanabe S
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: S. 573-578; ISBN 9798350343045
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2024,
Cruciani S, Campi T, Maradei F, Feliziani M
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: S. 816-820; ISBN 9798350343045
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2024,
Hassab Y, Esmaeili H, Schuster C
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: S. 584-589; ISBN 9798350343045
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2024,
Faraone A, Bit-Babik G, Russo P, De Leo A, Mariani Primiani V, De Santis V
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: S. 957-960; ISBN 9798350343045
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2024,
Miwa K, Ota S, Kawai K
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: S. 92-97; ISBN 9798350343045
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2024,
Ankarson P, Bergqvist B
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: S. 590-594; ISBN 9798350343045
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2024,
Bellosono L, D’ Agostino S, Colella M, Contessa GM, Polichetti A, Liberti M, Apollonio F
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: S. 579-583; ISBN 9798350343045
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2024,
Stroka S, Haussmann N, Kasolis F, Clemens M
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: S. 762-767; ISBN 9798350343045
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2024,
Zuo Z, Wang Q, Zheng J, Jeong H, Kumar A, Chen J
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 369-373; ISBN 9798350360400
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2024,
Huang X, Scoles S, Nguyen P, Chen J, Wisniewski J, Wan Y, Jiang GJ
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 365-368; ISBN 9798350360400
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2024,
Lee C, Rhee J, Lee S, Kwon H, Park Y, Shin Y, Ahn S
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 604-607; ISBN 9798350360400
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2024,
Ardeshirpour Y, Guag J, Silberberg JL, Seidman SJ
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 359-364; ISBN 9798350360400
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2024,
Cvetković M, Poljak D, Dodig H
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 167-172; ISBN 9798350360400
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2024,
Campi T, Cruciani S, Maradei F, Feliziani M
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 446-449; ISBN 9798350360400
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2024,
Clemente GC, Morais GI, Fonseca FHS, Concentino GL, Fraidenraich G
IEEE Electromagn Compat Mag 13 (2): 40-53